Flexible PCB Connector Alignment via Semicircular Concave Convex Features

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

In the development of downsized electronic devices, flexible printed circuit (FPC) boards and connectors face challenges in accurate outline processing, leading to potential electrical contact failures due to errors in positioning, especially in high-integration, narrow-pitch wiring patterns, and are prone to failures from dust or adhesive influences.

Innovation Solution

The solution involves forming semicircular concave portions on the FPC ends and corresponding semicircular convex portions on the connector members, allowing for precise alignment and electrical engagement, with the concave portions created through drilling and the convex portions molded, ensuring accurate positioning before wire formation to prevent contact failures.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If outline processing is performed on the opposite ends of the FPC after wiring is formed, then positioning accuracy is improved, but manufacturing precision deteriorates due to errors in the outline processing step

Engineering Contradiction:
Improvepositioning accuracyVSAvoidcontact position accuracy
Core Design Contradiction:
Measurement precisionVSManufacturing precision

Solution Approach 1:

The patent applies preliminary action by forming the wiring patterns on the FPC before performing the outline processing. The wiring is created on the flexible substrate first, and then the outline processing is performed to define the final contact positions. This sequence ensures that the wiring patterns are established with high precision before any positioning adjustments are made, preventing contact position errors that would occur if outline processing were done after wiring formation.

Inventive Principle:
Principle #10Preliminary action

2Ease of operation

If a clearance is defined between the boards, then assembly ease is improved, but reliability deteriorates due to contact failure from dust or adhesive

Engineering Contradiction:
Improveassembly easeVSAvoidcontact reliability
Core Design Contradiction:
Ease of operationVSReliability

Solution Approach 1:

The patent extracts the harmful factors (dust and adhesive) from the contact interface by implementing a contact structure where the FPC contacts the connector member directly without a defined clearance. By eliminating the clearance space between the FPC and connector member, the patent prevents dust particles and adhesive from entering the contact interface, thereby maintaining contact reliability while still allowing for ease of assembly through the outline processing alignment features.

Inventive Principle:
Principle #2Taking out (Extraction)

Data Source

PatentUS7387515B2Printed circuit board connection
Publication Date: 2008.06.17 DYNABOOK INC
  • US7387515B2 patent drawing
  • US7387515B2 patent drawing
  • US7387515B2 patent drawing

AI summary

An improved printed circuit board connection for connecting a first printed circuit board to a second printed circuit board in a manner that permits physical engagement at a different position than the electrical engagement, and a method for making the improved printed circuit board connection with precision in alignment. In one embodiment, the first printed circuit board includes an end portion configured to engage with a member of a connector on the second printed circuit board. The end portion and the member engage along concave portions of the end portion and convex portions of the member. When engaged, the end portion and the member align wires of the first printed circuit board with terminals of the connector.