Flexible PCB Wiring Module With Nested Connector Routing

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Solution Overview

Problem

The existing wiring modules in high-voltage battery packs require routing of sensing bus bars around connectors, leading to increased space and size, which is inefficient.

Innovation Solution

A wiring module using a flexible printed circuit board with conduction paths routed between the base film and connector surfaces, reducing the necessary space for routing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If the sensing bus bar is routed around the connector to connect to the rear surface, then the connector can be arranged on the first bus-bar frame, but the space necessary for routing increases and battery pack size increases

Engineering Contradiction:
Improveconnector arrangement flexibilityVSAvoidbattery pack size
Core Design Contradiction:
Adaptability or versatilityVSVolume of moving object

Solution Approach 1:

The conduction paths transition from surface routing (2D) to through-board routing (3D), passing through the thickness of the flexible printed circuit board to connect the connector to the sensing bus bar. This dimensional change eliminates the need for detour routing around the connector, reducing the horizontal space required while maintaining electrical connectivity.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The conduction paths are nested within the flexible printed circuit board structure, utilizing the board's internal space (between front and rear surfaces) to route the sensing bus bar connections. This nesting approach hides the routing paths within the component itself rather than requiring external space around the connector.

Inventive Principle:
Principle #7Nested doll (Nesting)

2Ease of manufacture

If the conduction paths are routed on the surface of the base film, then the connector can be connected to the conduction paths, but the height and space occupied by the wiring module increases

Engineering Contradiction:
Improveconnector connection easeVSAvoidwiring module height
Core Design Contradiction:
Ease of manufactureVSLength of stationary object

Solution Approach 1:

The conduction paths are routed through the thickness dimension of the flexible printed circuit board rather than extending along the surface. The paths pass from the front surface, through the board interior, to the rear surface where the connector is located, thereby minimizing the horizontal footprint and reducing the overall height of the wiring module.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The flexible printed circuit board utilizes its inherent flexibility and thin-film structure to route conduction paths through its volume. The board's flexible nature allows the conduction paths to be embedded within the board thickness, reducing the need for additional vertical space while maintaining electrical connectivity between the connector and power storage elements.

Inventive Principle:
Principle #30Flexible shells and thin films

Data Source

PatentUS12506227B2Wiring module
Publication Date: 2025.12.23 AUTONETWORKS TECH LTD
  • US12506227B2 patent drawing
  • US12506227B2 patent drawing
  • US12506227B2 patent drawing

AI summary

A wiring module is attached to a plurality of power storage elements, and includes: a flexible printed circuit board; and a protector holding the flexible printed circuit board, wherein the flexible printed circuit board includes a base film, a plurality of conduction paths that are disposed on a surface of the base film, and a connector that has an opposing surface opposing the surface of the base film and that is connected to the plurality of conduction paths, the plurality of conduction paths and electrode terminals of the plurality of power storage elements are electrically connected, the connector includes connection portions that are connected to the plurality of conduction paths, and at least some of the plurality of conduction paths are routed from the connection portions through a space between the surface of the base film and the opposing surface of the connector.