Flexible PCB Crimp Terminal Structure for Stable Conductivity
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Solution Overview
Problem
Conventional flexible printed circuit boards with connection terminals face challenges in maintaining conductivity and mechanical strength while minimizing weight and maximizing flexibility, especially when miniaturized and thinned, due to heat-related deterioration and crimping method limitations.
Innovation Solution
A flexible printed circuit board design featuring a base film with a conductor layer and crimping pieces that penetrate and bite into the conductor layer, removing it in specific regions to reduce load on the crimping pieces and stabilize conductivity, while optionally using a cover film and insulating reinforcing film to enhance strength and flexibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the base film or cover film thickness is increased to increase mechanical strength, then the strength is improved, but the weight increases and flexibility decreases
Solution Approach 1:
The conductor layer is selectively removed only in the specific region where the crimping piece penetrates the base film, rather than uniformly thickening the entire base film or cover film. This localized modification provides sufficient mechanical strength at the crimping location without increasing the overall weight or reducing flexibility of the FPC.
Solution Approach 2:
The conductor layer is removed in advance in the region where the crimping piece will penetrate, before the crimping process occurs. This preliminary action reduces the load on the crimping piece during penetration and ensures stable conductivity without requiring additional structural reinforcement that would increase weight.
2Weight of moving object
If the connection terminal is miniaturized and the wire is thinned to reduce weight and size, then the weight and volume are reduced, but it becomes difficult to maintain conductivity and strength
Solution Approach 1:
The conductor layer is selectively removed only in the specific region where the crimping piece penetrates, rather than uniformly thickening the entire base film or cover film. This localized modification provides sufficient mechanical strength at the crimping location without increasing the overall weight or reducing flexibility of the FPC.
Solution Approach 2:
The conductor layer is removed in advance in the region where the crimping piece will penetrate, before the crimping process occurs. This preliminary action reduces the load on the crimping piece during penetration and ensures stable conductivity without requiring additional structural reinforcement that would increase weight.
3Reliability
If the reflow soldering process is used to fix the connection terminal, then the connection is stable, but various members are heat-affected and manufacturing cost increases
Solution Approach 1:
The patent replaces the thermal bonding process (reflow soldering) with a mechanical bonding process (crimping). The crimping piece mechanically penetrates and bites into the conductor layer through the base film, establishing electrical and mechanical connection without requiring heat, thereby eliminating heat-related deterioration of members.
4Reliability
If the crimping piece penetrates through the base film and wire to be conductive, then the connection is established, but when the FPC is miniaturized and thinned, it is difficult to maintain conductivity and strength
Solution Approach 1:
The conductor layer is removed in advance in the region where the crimping piece will penetrate, before the crimping process occurs. This preliminary action reduces the load on the crimping piece during penetration and ensures stable conductivity without requiring additional structural reinforcement that would increase weight.
Solution Approach 2:
The conductor layer is selectively removed only in the specific region where the crimping piece penetrates, rather than uniformly thickening the entire base film or cover film. This localized modification provides sufficient mechanical strength at the crimping location without increasing the overall weight or reducing flexibility of the FPC.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables stable electrical connections with improved mechanical strength and conductivity, reducing the need for additional crimping pieces or increased crimping force, and prevents heat-related deterioration, thus maintaining performance without increasing weight or reducing flexibility.
Implementation Method 1
The crimping pieces penetrate the flexible printed circuit board by being crimped, and are bent in a direction opposite to a direction in which the crimping pieces penetrate the flexible printed circuit board, to bite into at least a part of the conductor layer
Data Source
AI summary
Provided is a flexible printed circuit board with connection terminal, including: a base film and a conductor layer provided on the base film, wherein the connection terminal includes a plurality of crimping pieces for fixing the connection terminal to the flexible printed circuit board, the crimping pieces penetrate the flexible printed circuit board by being crimped, and are bent in a direction opposite to a direction in which the crimping pieces penetrate the flexible printed circuit board, to bite into at least a part of the conductor layer, and the conductor layer is removed in a region of the conductor layer which the crimping pieces penetrate.