Flexible PCB Cable Assembly for High-Speed Dense Interconnects

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Solution Overview

Problem

Conventional PCB solutions fail to meet high-speed data transmission requirements and direct attach cables occupy excessive space, making them unsuitable for high-density and large quantity interconnections.

Innovation Solution

A chip-to-module cable assembly using a flexible PCB with a three-layer structure, comprising flexible material parts on upper and lower layers and a rigid connection portion in the middle, with rigid material portions for support and hollow portions for reduced material usage, allowing for high-speed signal transmission and flexible assembly.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Speed

If a conventional PCB solution is used to connect the switching chip to the I/O connector, then the interconnection is compact and integrates well, but it cannot satisfy the signal transmission requirement at high speeds higher than the specified speed threshold

Engineering Contradiction:
Improvedata transmission speedVSAvoidsignal transmission capability
Core Design Contradiction:
SpeedVSReliability

Solution Approach 1:

The interconnection path is segmented into two parts: a flexible PCB cable with hollow cross-section for high-speed signal transmission, and a rigid PCB for structural support and low-speed connections. This segmentation allows each part to be optimized for its specific function, resolving the contradiction between speed and reliability.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The flexible PCB cable uses a composite structure with hollow cross-section, combining flexible material parts and rigid material portions. This composite design enables the cable to achieve both high-speed signal transmission capability and mechanical flexibility, overcoming the limitations of conventional solid PCB structures.

Inventive Principle:
Principle #40Composite materials

2Loss of energy

If a cable is directly connected between the switching chip and the I/O connector to achieve low loss, then the signal transmission quality improves, but the cable occupies large space and is difficult to assemble

Engineering Contradiction:
Improvesignal lossVSAvoidspace occupancy
Core Design Contradiction:
Loss of energyVSVolume of moving object

Solution Approach 1:

The patent uses a flexible PCB cable with a thin-walled hollow cross-section design. This flexible shell structure maintains the low signal loss characteristics of cable connections while significantly reducing the space occupancy compared to traditional rigid cables, and improving assembly flexibility.

Inventive Principle:
Principle #30Flexible shells and thin films

Solution Approach 2:

The flexible PCB cable employs a hollow cross-section structure that can be filled with foam or air, creating a porous-like internal structure. This design reduces the overall volume of the cable while maintaining its mechanical strength and electrical performance, resolving the contradiction between signal loss and space occupancy.

Inventive Principle:
Principle #31Porous materials

3Volume of moving object

If a flexible PCB cable with hollow cross-section is used, then space is saved and assembly is facilitated, but the structure becomes more complex

Engineering Contradiction:
Improvespace occupancyVSAvoidstructural complexity
Core Design Contradiction:
Volume of moving objectVSDevice complexity

Solution Approach 1:

The patent transitions from a conventional two-dimensional PCB layout to a three-dimensional flexible cable structure with hollow cross-section. This dimensional change allows the interconnection to pass through complex spatial paths, saving space and facilitating assembly while the modular joint design keeps the overall system complexity manageable.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The hollow cross-section of the flexible PCB cable can be filled with other components or nested within other structures, creating a nested configuration. This nesting approach reduces the overall volume required and simplifies the integration with other system components, offsetting the increased structural complexity.

Inventive Principle:
Principle #7Nested doll (Nesting)

Data Source

PatentUS11784425B1Chip-to-module cable assembly and PCB circuit
Publication Date: 2023.10.10 RUIJIE NETWORKS CO LTD
  • US11784425B1 patent drawing
  • US11784425B1 patent drawing
  • US11784425B1 patent drawing

AI summary

This application relates to a chip-to-module cable assembly, includes a first joint, a second joint and a first flexible PCB cable, the flexible PCB cable, including flexible material parts located on upper and lower layers and a connection portion located on a middle layer, wherein the connection portion comprises two rigid material portions respectively located at end portions of the flexible material parts on the upper and lower layers and a hollow portion between the two rigid material portions, the flexible material parts each comprises at least one conducting wire, one end of each of the at least one conducting wire is connected to a first interface terminal of the first joint, and another end of the conducting wire is connected to a second interface terminal of a second joint.