Flexible PCB with Embedded Components for 5G Signal Loss
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Solution Overview
Problem
Existing materials and structures struggle to seamlessly transmit high-frequency signals above 10 GHz in 5G wireless networks without significant signal loss.
Innovation Solution
A printed circuit board design featuring a flexible insulating layer with alternating thermoplastic and thermosetting resin layers, embedded electronic elements, and a rigid insulating layer with antennas, which reduces signal transmission distance and loss by integrating electronic components within the flexible layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If existing materials and structures are used for signal transmission, then the structure is simple and easy to manufacture, but signal loss increases significantly at frequencies of 10 GHz or more
Solution Approach 1:
The patent employs composite materials consisting of alternating thermoplastic resin layers and thermosetting resin layers. The thermoplastic resin layers provide flexibility and low signal loss characteristics, while the thermosetting resin layers provide structural stability and rigidity. This composite structure enables effective high-frequency signal transmission above 10 GHz by reducing signal loss through the optimized material combination.
2Loss of energy
If electronic elements are mounted on the surface of the rigid insulating layer, then the manufacturing process is simple, but the signal transmission distance is long and signal loss increases
Solution Approach 1:
The patent embeds electronic elements within the flexible insulating layer during the lamination process, nesting the elements inside the multi-layer structure rather than mounting them on the surface. This embedding approach shortens the signal transmission distance by placing elements closer to the signal path, thereby reducing signal loss while maintaining manufacturing feasibility through integrated processing.
Solution Approach 2:
The patent transitions from two-dimensional surface mounting to three-dimensional embedding within the insulating layer structure. By placing electronic elements at different depths and positions within the multi-layer flexible insulating structure, the design optimizes signal transmission paths and reduces transmission distance, achieving lower signal loss through spatial optimization.
3Loss of energy
If a rigid insulating layer is used for the entire PCB, then the structural stability is high, but the signal transmission efficiency at high frequencies is reduced due to longer transmission distances
Solution Approach 1:
The patent applies different material properties to different regions and layers of the PCB structure. The flexible insulating layers, composed of thermoplastic and thermosetting resins, are specifically designed to provide low signal loss characteristics for high-frequency transmission paths. The rigid insulating layers provide structural support where needed. This local optimization of material properties achieves both low signal loss and adequate structural stability.
Solution Approach 2:
The patent divides the insulating structure into multiple segments: alternating flexible insulating layers (with embedded electronic elements) and rigid insulating layers. This segmentation allows each layer to perform its specific function - the flexible layers optimize signal transmission by reducing loss, while the rigid layers provide structural support. The segmented structure achieves overall performance optimization by combining the advantages of different material types.
Data Source
AI summary
Provided is a printed circuit board including: a first flexible insulating layer; a first rigid insulating layer stacked on a first portion of the first flexible insulating layer; and an electronic element embedded in the first flexible insulating layer in stacked formation with the rigid insulating layer.