Flexible PCB Hand Temperature Sensor with Carbon Fiber Protection
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Solution Overview
Problem
Conventional hand temperature monitoring devices lack sensitivity and durability, leading to inaccurate temperature readings and frequent damage due to repeated use, which is critical for precise Chinese medicine diagnosis.
Innovation Solution
A hand temperature monitoring device featuring a flexible printed circuit board with temperature sensors and p-type MOSFETs, protected by a carbon fiber board and polymer films, along with a processor and multiplexers for independent sensor control, providing high-resolution and durable temperature mapping.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional hand temperature monitoring devices are used, then the device structure is simple, but the measurement precision and sensitivity are insufficient
Solution Approach 1:
The sensing array is divided into multiple independent temperature sensors arranged in a matrix pattern across the flexible printed circuit board. Each sensor independently measures temperature at specific locations, enabling high-resolution temperature mapping of the hand surface while maintaining a modular structure that balances precision with manufacturability
Solution Approach 2:
The patent transitions from point-based temperature measurement to a two-dimensional temperature distribution measurement by arranging temperature sensors in a matrix pattern on a flexible printed circuit board. This dimensional expansion enables comprehensive hand temperature mapping while distributing structural complexity across a planar array
2Ease of operation
If the sensing units are exposed for frequent contact, then the ease of operation is improved, but the reliability and durability deteriorate due to wears and damage
Solution Approach 1:
A protective layer is applied over the temperature sensors and circuit board before use. This pre-applied protection shields the sensing units from mechanical damage during frequent hand contacts, ensuring durability while maintaining tactile responsiveness for accurate temperature measurement
Solution Approach 2:
A flexible protective film is used to cover the sensing array. This thin film provides mechanical protection to the temperature sensors and circuit board during frequent contact operations while remaining sufficiently thin and flexible to allow accurate temperature sensing through the protective layer
3Measurement precision
If the temperature sensors are densely arranged to capture small surface areas like finger tips, then the measurement precision is improved, but the device complexity increases
Solution Approach 1:
The temperature sensing array is segmented into multiple independent sensors distributed across the flexible printed circuit board. This segmentation enables dense arrangement of sensors to capture fine temperature variations on small surface areas like finger tips, with each sensor acting as an independent measurement unit
Solution Approach 2:
The flexible printed circuit board serves multiple functions: it provides the structural substrate for mounting temperature sensors, enables flexible conforming to hand surfaces, and facilitates electrical connections between sensors. This multi-functionality reduces overall device complexity despite high sensor density
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device achieves accurate temperature readings with high sensitivity and durability, capable of capturing minor temperature changes across the hand, enhancing diagnostic precision and longevity.
Implementation Method 1
temperature sensors are disposed on a first side of the flexible printed circuit board
Data Source
AI summary
A hand temperature monitoring device includes at least one sensing array composed of a flexible printed circuit board (110), temperature sensors (120), p-type metal oxide semiconductor field-effect transistors (MOSFETs) (130), polymer films (140) and carbon fiber boards (150). The temperature sensors (120) are disposed on a first side (112) of the flexible printed circuit board (110). The p-type MOSFETs (130) are disposed on a second side (114) of the flexible printed circuit board (110) opposing to the temperature sensors (120), wherein each of the p-type MOSFETs (130) is electrically connected to one of the temperature sensors (120). The polymer film (140) encapsulates each of the temperature sensors (120) and the p-type MOSFETs (130) respectively. The carbon fiber board (150) is positioned over the polymer film and spaced apart from the polymer film (140).