Flexible PCB Imaging Module for Endoscope Bending Strength

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Solution Overview

Problem

Conventional imaging modules for electronic endoscopes face challenges in reducing size while maintaining mechanical strength, particularly in the bending portion of the inner lead, which requires resin potting for reinforcement, making it difficult to achieve a thin diameter and high mechanical strength simultaneously.

Innovation Solution

The use of a flexible printed circuit board with integrated insulating layers, allowing for bending at specific areas with a small radius of curvature, eliminating the need for resin potting and enhancing mechanical strength through a stepped portion design for easier bending and improved alignment.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Area of stationary object

If the inner lead is bent with a small radius of curvature to reduce imaging module size, then the imaging module area is reduced, but the mechanical strength of the bending portion deteriorates

Engineering Contradiction:

Improveimaging module areaVSAvoidmechanical strength of inner lead bending portion

Core Design Contradiction:

Area of stationary objectVSStrength

Solution Approach 1:

The patent applies this principle by using a flexible substrate with integrated insulating layers that can bend with small radius of curvature. The flexible substrate structure allows the inner lead to bend sharply without requiring resin potting reinforcement, thus reducing the imaging module area while maintaining mechanical strength.

Inventive Principle:

Principle #30Flexible shells and thin films

Solution Approach 2:

The patent applies this principle by creating a composite structure where the insulating layer is integrated directly onto the flexible substrate. This composite design provides both mechanical support and electrical insulation, eliminating the need for separate resin potting and enabling small radius bending while maintaining strength.

Inventive Principle:

Principle #40Composite materials

2Strength

If resin potting is applied to reinforce the inner lead bending portion to maintain mechanical strength, then the mechanical strength is improved, but the imaging module size increases due to additional resin material

Engineering Contradiction:

Improvemechanical strength of inner lead bending portionVSAvoidamount of resin potting

Core Design Contradiction:

StrengthVSQuantity of substance

Solution Approach 1:

The patent applies this principle by merging the insulating layer and flexible substrate into a single integrated structure. This combination eliminates the need for separate resin potting material, reducing the quantity of substance required while maintaining mechanical strength through the integrated design.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The integrated insulating layer on the flexible substrate acts as a thin film structure that provides both mechanical reinforcement and electrical insulation, replacing the need for bulky resin potting material and reducing overall imaging module size.

Inventive Principle:

Principle #30Flexible shells and thin films

3Reliability

If the insulating layer is applied separately to the bent inner lead to ensure insulation, then the electrical insulation is improved, but the device complexity increases due to additional insulation steps

Engineering Contradiction:

Improveelectrical insulation between inner lead and imaging deviceVSAvoidcomplexity of insulation structure

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent applies this principle by combining the insulating layer formation with the flexible substrate manufacturing process. The insulating layer is integrated directly onto the flexible substrate in a single manufacturing step, eliminating separate insulation application steps and reducing device complexity while ensuring electrical insulation reliability.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The insulating layer is formed on the flexible substrate before the inner lead bending and assembly processes. This preliminary action ensures electrical insulation is already in place before bending occurs, simplifying the overall manufacturing process and reducing the need for subsequent insulation steps.

Inventive Principle:

Principle #10Preliminary action

Data Source

PatentUS7808551B2Imaging module and method of manufacturing imaging module

Publication Date: 2010.10.05 OLYMPUS CORPORATION(JP)

AI summary

An imaging module includes a flexible printed circuit board which has a first area on which a first functional element is mounted, a second area on which a second functional element is mounted, and a third area which is formed between the first area and the second area, an electronic component which is mounted on the first area, and an imaging device which is mounted on the second area. The flexible printed circuit board is formed by an insulating layer which is integrated, spreading over the first area, the second area, and the third area. The flexible printed circuit board is formed such that the flexible printed circuit board can be bent at least in the third area.