Flexible PCB Land Segmentation for Stable Reflow-Soldered Terminals
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Solution Overview
Problem
The configuration of a tongue-shaped linking portion connected to a contact pad with reflow soldering on flexible printed circuit boards can lead to position displacement issues during the soldering process, causing problems with terminal positioning.
Innovation Solution
A flexible printed circuit board design featuring soldering portions with metal surfaces and a non-metal dividing section between them, which suppresses solder movement and maintains terminal position stability during reflow soldering.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the linking portion is connected to the contact pad with reflow soldering, then the electrical connection is achieved, but the linking portion may be moved during the reflow soldering causing position displacement
Solution Approach 1:
The land is divided into multiple soldering portions (first soldering portion and second soldering portion) separated by a dividing section. This segmentation prevents solder from flowing between adjacent soldering areas during reflow, thereby preventing terminal position displacement while maintaining reliable electrical connection.
Solution Approach 2:
A dividing section is introduced as an intermediary element between adjacent soldering portions. This dividing section acts as a barrier that prevents solder movement during reflow soldering, solving the position displacement problem while allowing each soldering portion to independently form reliable electrical connections.
2Ease of manufacture
If the linking portion is disposed on the contact pad, then the soldering process can be performed, but the linking portion may move during reflow soldering
Solution Approach 1:
The contact pad is segmented into multiple soldering portions with dividing sections between them. This segmentation maintains the ease of soldering process while preventing the linking portion from moving during reflow, as the dividing sections restrict solder flow that would otherwise cause position displacement.
Solution Approach 2:
The dividing section serves as an intermediary structure that stabilizes the terminal position during soldering. It allows the soldering process to proceed easily while preventing excessive solder movement that would displace the linking portion, thus maintaining both manufacturing ease and position stability.
3Productivity
If reflow soldering is used to connect the linking portion, then efficient electrical connection is achieved, but position displacement of the terminal occurs
Solution Approach 1:
The land is segmented into multiple soldering portions separated by dividing sections. This allows efficient reflow soldering to be performed while the dividing sections prevent solder from causing terminal position displacement, thus maintaining both productivity and positioning accuracy.
Solution Approach 2:
The dividing section acts as an intermediary barrier during reflow soldering. It enables the efficient heating and soldering process to proceed while preventing the harmful effect of solder-induced terminal displacement, thereby maintaining both soldering efficiency and positioning accuracy.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively reduces the likelihood of terminal position displacement, ensuring reliable soldering and preventing issues related to terminal movement during the reflow process.
Implementation Method 1
The linking portion and the contact pad are connected with reflow soldering
Data Source
AI summary
A flexible printed circuit board includes an electrically conductive line, and a land connected to the electrically conductive line and to be connected to a terminal, the land including soldering portions that have metal surfaces and to which the terminal is to be soldered. The terminal includes an overlapping section that overlaps the flexible printed circuit board and a protruding section that protrudes outward from the flexible printed circuit board and is soldered to a connecting member that connects electrode portions of power storage elements.