3D Flexible PCB Module Layout for Reliable Switching Control

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Solution Overview

Problem

Conventional printed circuit boards (PCBs) in control modules are prone to signal transmission errors due to complex pin header connections, require significant space, and expose temperature-sensitive components to heat from heat-generating components, disrupting accurate temperature measurements.

Innovation Solution

A sectionally flexible printed circuit board assembly with at least three rigid and two flexible PCB sections forms a three-dimensional structure within the module housing, using positive-locking connections and flexible polyimide film to separate temperature-sensitive components from heat-generating components, allowing for efficient space utilization and improved signal transmission.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If conventional rigid PCBs are stacked on top of each other with pin header connections, then space requirement is reduced, but signal transmission reliability deteriorates due to complex pin headers and thermal stresses

Engineering Contradiction:
Improvespace requirementVSAvoidsignal transmission reliability
Core Design Contradiction:
Volume of moving objectVSReliability

Solution Approach 1:

The PCB is divided into multiple rigid sections (first PCB section, second PCB section, third PCB section) that are connected through flexible sections. This segmentation allows each rigid section to be optimized independently while maintaining overall structural integrity and signal transmission reliability through the flexible connecting sections.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Flexible printed circuit board sections are used to connect the rigid PCB sections. These flexible sections can accommodate thermal expansion and mechanical stresses while maintaining electrical connections, thereby improving signal transmission reliability compared to rigid pin header connections.

Inventive Principle:
Principle #30Flexible shells and thin films

2Volume of moving object

If conventional rigid PCBs are stacked on top of each other, then space requirement is reduced, but manufacturing complexity increases due to pin header connections

Engineering Contradiction:
Improvespace requirementVSAvoidmanufacturing complexity
Core Design Contradiction:
Volume of moving objectVSEase of manufacture

Solution Approach 1:

The PCB is divided into multiple rigid sections (first PCB section, second PCB section, third PCB section) that are connected through flexible sections. This segmentation allows each rigid section to be optimized independently while maintaining overall structural integrity and signal transmission reliability through the flexible connecting sections.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Flexible printed circuit board sections are used to connect the rigid PCB sections. These flexible sections can accommodate thermal expansion and mechanical stresses while maintaining electrical connections, thereby improving signal transmission reliability compared to rigid pin header connections.

Inventive Principle:
Principle #30Flexible shells and thin films

3Volume of moving object

If heat-generating components are placed on the same PCB as temperature-sensitive components, then space utilization is improved, but measurement precision deteriorates due to thermal interference

Engineering Contradiction:
Improvespace utilizationVSAvoidtemperature measurement precision
Core Design Contradiction:
Volume of moving objectVSMeasurement precision

Solution Approach 1:

The PCB is divided into multiple rigid sections (first PCB section, second PCB section, third PCB section) that are connected through flexible sections. This segmentation allows each rigid section to be optimized independently while maintaining overall structural integrity and signal transmission reliability through the flexible connecting sections.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The flexible PCB sections allow the rigid PCB sections to be arranged in a three-dimensional configuration rather than a simple planar stack. This enables spatial separation of heat-generating components from temperature-sensitive components while maintaining electrical connections, thereby improving temperature measurement precision.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Data Source

PatentEP4391737B1Module for a switching device
Publication Date: 2026.01.28 K & N SCHALTERENTWICKLUNGSGES
  • EP4391737B1 patent drawingFigure 1~2
  • EP4391737B1 patent drawingFigure 3~4
  • EP4391737B1 patent drawingFigure 5

AI summary

The invention relates to a module (1), in particular for arrangement in a control cabinet of a low-voltage distribution system, wherein the module (1) comprises a module housing (2).Within the module housing (2) a sectionally flexible printed circuit board assembly (20) is arranged with at least three rigid printed circuit board sections (21, 22, 23, 24, 25, 26) and with at least two flexible printed circuit board sections (31, 32, 33, 34, 35), wherein at least one flexible printed circuit board section (31, 32, 33, 34, 35) is arranged between two adjacent rigid printed circuit board sections (21, 22, 23, 24, 25, 26) and is electrically connected to these two adjacent rigid printed circuit board sections (21, 22, 23, 24, 25, 26) in a signal-conducting manner, and wherein the sectionally flexible printed circuit board assembly (20) in its installed position within the module housing (2) forms a three-dimensional structure (40) in which at least a first pair of two adjacent rigid printed circuit board sections (21, 22) encloses a first angle (α) to each other and at least one second pair of two adjacent rigid circuit board sections (22,23) encloses a second angle (β) to each other.