Flexible PCB Interconnection Using Fused Conductive Nanowires

The patent replaces the mechanical soldering process with a nanowire-based interconnection system. Conductive nanowires are deposited on conductive areas at the edges of the flexprints, and when the flexprints are brought into contact, the nanowires intertangle and fuse to create electrical connections without requiring soldering equipment or manual intervention, thus eliminating the complex and time-consuming soldering process while maintaining reliable electrical connection.

The patent changes the scale parameter by using nanowires (nanometer scale) instead of traditional solder joints (micrometer/millimeter scale). This parameter change enables automatic interconnection through nanowire intertangling and fusion, simplifying the interconnection process while achieving reliable electrical contact between fine conductive traces on flexible printed circuit boards.

The patent replaces the time-consuming manual or automated soldering process with a nanowire-based system that forms connections through simple contact and nanowire intertangling. The nanowires are pre-deposited on the flexprint edges, and when the boards are assembled, the nanowires automatically intertangle and fuse, eliminating the need for heating, cooling, and inspection cycles associated with soldering, thus dramatically reducing interconnection process time.

The patent applies preliminary action by pre-depositing conductive nanowires on the conductive areas at the edges of the flexprints during the manufacturing process. This preliminary preparation eliminates the need for time-consuming soldering operations during assembly, as the nanowires are already in position and will automatically form connections upon contact between the flexprints.

The patent replaces the rigid solder joint with a nanowire-based interconnection system that is inherently more compliant with mechanical stress. The nanowires, being at the nanometer scale and capable of intertangling, can accommodate bending and flexing of the flexible printed circuit boards without creating rigid stress concentration points, thus reducing mechanical stress sensitivity while maintaining reliable electrical connection for fine conductive traces.

The patent employs nanowires that can flex and deform with the flexible printed circuit boards, similar to how flexible shells and thin films adapt to mechanical deformation. The nanowire intertangled structure can bend and flex without breaking, accommodating the mechanical stress that occurs during board assembly and operation, thereby reducing sensitivity to mechanical stress compared to rigid solder joints.

The patent replaces complex mechanical fastening systems with a nanowire-based interconnection approach. The nanowires, when intertangled and fused, create both mechanical and electrical connections simultaneously through a simple contact process. This eliminates the need for additional mechanical fasteners, adhesives, or complex alignment systems, achieving strong mechanical connection for fine traces without increasing process complexity.

The patent merges the mechanical connection and electrical connection functions into a single nanowire interconnection system. The nanowires provide both structural support for mechanical strength and conductive pathways for electrical connection, eliminating the need for separate mechanical fastening and electrical connection systems, thus achieving strong mechanical connection without increasing overall process complexity.