Flexible PCB Pad Pressing to Prevent Electrode Misalignment

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Solution Overview

Problem

Existing technologies face challenges in precisely pressing flexible printed circuit boards to substrates in display devices, leading to misalignment and tension issues between pad electrodes, which affect contact areas and display performance.

Innovation Solution

A press apparatus and method that utilize a stage, a fixing member with a guide pin and press jig to align and press pad electrodes of a flexible printed circuit board with those of a substrate, ensuring precise alignment and contact by addressing the tension generated in pad electrode-free areas.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a flexible printed circuit board is pressed to a substrate, then electrical connection is achieved, but tension in the pad electrode-free area causes misalignment of pad electrodes

Engineering Contradiction:
Improveelectrical connection reliabilityVSAvoidpad electrode alignment precision
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The pressing apparatus is divided into multiple independent pressing members: a first pressing member that presses only the pad electrode-free area, and a second pressing member that presses the pad electrode area. This segmentation allows each pressing member to independently control the pressing force and displacement, preventing misalignment caused by tension while ensuring reliable electrical connection.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different pressing members are applied to different areas of the flexible printed circuit board based on local requirements. The first pressing member applies pressing force to the pad electrode-free area to release tension, while the second pressing member applies pressing force to the pad electrode area to ensure electrical connection. This local quality approach ensures that each area receives the appropriate pressing treatment without affecting the other.

Inventive Principle:
Principle #3Local quality

2Reliability

If the flexible printed circuit board is pressed to ensure contact, then electrical connection is improved, but the tension in pad electrode-free area causes misalignment

Engineering Contradiction:
Improvecontact reliabilityVSAvoidalignment precision
Core Design Contradiction:
ReliabilityVSMeasurement precision

Solution Approach 1:

The first pressing member performs preliminary pressing action on the pad electrode-free area before the second pressing member presses the pad electrode area. This preliminary action releases tension in the pad electrode-free area, preventing it from causing misalignment during the subsequent pressing of the pad electrodes, thereby ensuring both alignment precision and contact reliability.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The pressing apparatus employs dynamic control by using multiple pressing members that can independently displace and apply pressing force. The first pressing member and second pressing member can adjust their pressing force and displacement dynamically, allowing the system to adapt to the different mechanical requirements of the pad electrode-free area and the pad electrode area, thus achieving both precise alignment and reliable contact.

Inventive Principle:
Principle #15Dynamics

Data Source

PatentUS11991834B2Pressing method of a flexible printed circuit board and a substrate
Publication Date: 2024.05.21 SAMSUNG DISPLAY CO LTD
  • US11991834B2 patent drawing
  • US11991834B2 patent drawing
  • US11991834B2 patent drawing

AI summary

A pressing method operatively associated with a press apparatus includes: providing a first substrate connected with a flexible printed circuit board onto a stage; providing a second substrate onto the stage; arranging the flexible printed circuit board on the second substrate; pressing a pad electrode-free area of the flexible printed circuit board; and pressing first pad electrodes of the flexible printed circuit board and second pad electrodes of the second substrate.