Flexible PCB Redundant Traces for IoT Device Resilience

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Solution Overview

Problem

Conventional asset tracking devices are prone to physical damage in harsh environments such as shipping and logistics, leading to loss of functionality when conductive traces are damaged.

Innovation Solution

A resilient wireless tracking device with a flexible printed circuit board featuring redundant conductive traces and components that can switch functionality in case of damage, maintaining electrical connections and device operation even after physical trauma.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional rigid PCB structures are used in tracking devices, then manufacturing is simpler and device assembly is easier, but the device becomes vulnerable to physical damage in harsh environments

Engineering Contradiction:

Improvedevice functionalityVSAvoidphysical damage

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The conductive trace is divided into multiple sub-traces that are spatially separated. When physical damage occurs, only some sub-traces may be damaged while others remain functional, allowing the device to maintain operation through the surviving redundant pathways.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Redundant conductive sub-traces are pre-configured in the PCB before deployment. This proactive design ensures that backup pathways exist ahead of time to compensate for potential future damage, allowing the device to withstand harsh shipping and logistics environments without complete failure.

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

2Reliability

If redundant conductive sub-traces are implemented, then the device becomes more resilient to physical damage, but the PCB complexity and manufacturing difficulty increase

Engineering Contradiction:

Improveelectrical connectionVSAvoidPCB structure

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent employs flexible PCB technology where multiple conductive sub-traces are printed or etched onto flexible substrate layers. This approach achieves redundancy without requiring complex rigid multi-layer structures, maintaining relative manufacturing simplicity while providing damage tolerance through the flexible, distributed trace architecture.

Inventive Principle:

Principle #30Flexible shells and thin films

3Reliability

If multiple redundant components are placed on the PCB, then the device can switch functionality upon damage detection, but the device size and component count increase

Engineering Contradiction:

Improvedevice operationVSAvoidPCB area

Core Design Contradiction:

ReliabilityVSArea of stationary object

Solution Approach 1:

The redundant conductive sub-traces are designed to serve multiple potential functions depending on which traces remain intact after damage. The same physical infrastructure (the network of sub-traces) can support different operational configurations, allowing the device to adapt its functionality without requiring dedicated backup components for each possible failure mode.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Data Source

PatentUS11861441B1Spreading out electronics in an internet of things device for resiliency to environmental hazards

Publication Date: 2024.01.02 TRACKONOMY SYSTEMS INC

AI summary

A resilient flexible adhesive tape platform includes a flexible substrate, a flexible cover layer on the flexible substrate, a device layer in between the flexible substrate and the flexible cover layer comprising components connected to a resilient printed circuit board, and the resilient printed circuit board (PCB) in between the flexible substrate and the flexible cover layer. The flexible printed circuit board includes a resilient conductive trace on the PCB connecting two of the components, the resilient conductive trace comprising a plurality of sub-traces, each of the plurality of sub-traces electrically redundantly connecting the two electronic components to each other.