Flexible PCB External Sensor Exposure for IoT Signal Accuracy

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Solution Overview

Problem

Existing electronic devices face inaccuracies in sensor measurements and reduced signal strength due to internal placement of sensors and antennas, which are affected by internal environmental conditions and insulation, leading to poor performance in devices like IoT devices.

Innovation Solution

Integrating sensors and antennas onto flexible PCB circuits that serve as an external surface of the device enclosure, allowing increased environmental exposure while maintaining electrical coupling to internal circuitry through flexible cables and multiple layered configurations to maximize exposure and performance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If sensors and antennas are placed inside the device enclosure, then device integration and compactness are improved, but measurement accuracy and signal strength deteriorate due to internal environmental conditions and insulation

Engineering Contradiction:

Improvedevice compactnessVSAvoidsensor measurement accuracy

Core Design Contradiction:

Volume of moving objectVSMeasurement precision

Solution Approach 1:

The patent transitions sensors and antennas from internal placement (2D plane within enclosure) to external placement on the enclosure surface, utilizing the third dimension (depth/extension outward) to resolve the contradiction between compactness and measurement accuracy

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent extracts sensors and antennas from the internal environment of the enclosure and relocates them to the external surface, removing them from the harmful internal environment while maintaining device compactness through integrated surface mounting

Inventive Principle:

Principle #2Taking out (Extraction)

2Device complexity

If sensors are placed inside the device enclosure, then device integration is improved, but signal strength and environmental detection capability worsen due to insulation and internal conditions

Engineering Contradiction:

Improvedevice integrationVSAvoidsignal strength

Core Design Contradiction:

Device complexityVSReliability

Solution Approach 1:

The patent relocates antennas from internal to external placement on the enclosure surface, using dimensional transition to improve signal strength while maintaining integration through surface-mount technology

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent extracts antennas from the insulating internal environment and places them externally, removing the harmful insulation effect while maintaining device integration through unified enclosure design

Inventive Principle:

Principle #2Taking out (Extraction)

3Measurement precision

If additional holes are created in the enclosure for better airflow, then sensor exposure to external environment is improved, but aesthetic appearance and enclosure integrity worsen

Engineering Contradiction:

Improvesensor environmental exposureVSAvoidenclosure aesthetic appearance

Core Design Contradiction:

Measurement precisionVSShape

Solution Approach 1:

The patent extracts sensors from the internal enclosure environment and relocates them to the external surface, eliminating the need for airflow holes and preserving enclosure integrity and aesthetics

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

Instead of creating holes inward from the exterior to expose sensors, the patent inverts the approach by placing sensors directly on the exterior surface, eliminating the need for penetrating openings

Inventive Principle:

Principle #13The other way round (Inversion)

4Measurement precision

If algorithmic adjustment is used to correct sensor readings, then measurement accuracy under internal conditions is improved, but accuracy under varying internal conditions deteriorates due to unpredictable environmental changes

Engineering Contradiction:

Improvesensor reading accuracyVSAvoidaccuracy under varying conditions

Core Design Contradiction:

Measurement precisionVSAdaptability or versatility

Solution Approach 1:

The patent extracts sensors from the unpredictable internal environment and places them externally where environmental conditions are stable and representative, eliminating the need for algorithmic corrections and providing inherent adaptability to varying external conditions

Inventive Principle:

Principle #2Taking out (Extraction)

Data Source

PatentUS11229122B2Increasing exposure of integrated circuit components

Publication Date: 2022.01.18 SHAGHGAMYAN DAVIT

AI summary

Techniques are described for an electronic device to increase the exposure of the externally bound components, such as sensors and antennas, which performance is improved by such exposure. A flexible printed circuit board (PCB) is affixed to the top surface of the device's enclosure, thereby placing the flexible PCB outside of the enclosure. Externally bound component(s) are integrated onto the flexible PCB, which has multiple layers, including an interface layer and a spacer layer. The spacer layer has an aperture extending through the layer at the locations corresponding to the externally bound components, thereby exposing the externally bound component's surface.