Flexible PCB Circuit Carrier for Battery Shunt Stress Isolation
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Solution Overview
Problem
Existing battery system circuit carriers face mechanical stress issues due to rigid connections between printed circuit boards and housing, which can damage sensitive components like ceramic capacitors and quartz crystals, especially during temperature changes and assembly.
Innovation Solution
A circuit carrier with a spring-like structure formed from a printed circuit board, featuring a first region for mounting a shunt resistor and a second region for additional components, separated by a flexible third region that provides an elastic connection, decoupling mechanical impacts and allowing for dimensional compensation without stressing components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If a rigid connection is used between the printed circuit board and housing, then structural stability is improved, but mechanical stress damages sensitive components
Solution Approach 1:
The patent introduces a damping layer comprising a viscoelastic material between the printed circuit board and the housing. This flexible damping layer absorbs mechanical stress and vibrations while maintaining structural stability, preventing damage to sensitive components like ceramic capacitors and quartz crystals during assembly and operation.
2Adaptability or versatility
If temperature changes occur, then thermal expansion causes dimensional changes, but rigid connections transmit stress to components
Solution Approach 1:
The viscoelastic damping layer provides dimensional compensation during thermal expansion and contraction cycles. Its flexible nature allows it to deform with temperature-induced dimensional changes while absorbing the resulting mechanical stress, protecting sensitive components from stress damage.
3Force
If vibrations are transmitted to the circuit board, then mechanical impacts reach sensitive components, but component durability decreases
Solution Approach 1:
The damping layer acts as a pre-positioned cushion between the printed circuit board and housing. It absorbs and dissipates mechanical impacts and vibrations before they can reach sensitive components, thereby extending component lifespan and improving overall system durability.
Solution Approach 2:
The viscoelastic material in the damping layer provides vibration isolation through its flexible, energy-dissipating properties. It converts mechanical vibration energy into heat through internal friction, preventing vibrations from transmitting to and damaging sensitive electronic components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The circuit carrier effectively reduces mechanical stress and vibrations transmitted to sensitive components, enhancing the durability and reliability of battery system control units by providing a flexible connection mechanism that dampens impacts and compensates for dimensional changes.
Implementation Method 1
the third region comprises a spring-like structure that is configured to provide an elastic connection between the first and second regions
Implementation Method 2
The circuit carrier effectively reduces mechanical stress and vibrations transmitted to sensitive components, enhancing the durability and reliability
Data Source
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AI summary
The present invention is directed to a circuit carrier (40), preferably of a cell supervision circuit (30) or a battery management system (50), wherein the circuit carrier (40) is configured to be mounted to a battery system (100). Therefore, the circuit carrier (40) has a circuit carrier board (44) with a first region (41) and with a second region (42), wherein the first region (41) is configured to receive a shunt resistor (45) and wherein the second region (42) is configured to receive further electronic components, preferably a voltage measurement circuit. In the circuit carrier (40) of the invention, the first region (41) and the second region (42) are separated from each other by a third region (43) that is configured for forming a flexible connection between the first region (41) and the second region (42) and that comprises a spring-like structure (46) formed from the circuit carrier board (44). Preferably, the spring-like structure (46) comprises at least one meander-shaped structure (47) that connects the first region (41) and the second region (42), wherein the material of the remaining third region (43) is removed, e.g. in a milling process of the circuit carrier (40).