Flexible PCB Circuit Carrier for Battery Shunt Stress Isolation

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Solution Overview

Problem

Existing battery system circuit carriers face mechanical stress issues due to rigid connections between printed circuit boards and housing, which can damage sensitive components like ceramic capacitors and quartz crystals, especially during temperature changes and assembly.

Innovation Solution

A circuit carrier with a spring-like structure formed from a printed circuit board, featuring a first region for mounting a shunt resistor and a second region for additional components, separated by a flexible third region that provides an elastic connection, decoupling mechanical impacts and allowing for dimensional compensation without stressing components.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Stability of the object's composition

If a rigid connection is used between the printed circuit board and housing, then structural stability is improved, but mechanical stress damages sensitive components

Engineering Contradiction:
Improvestructural stabilityVSAvoidcomponent reliability
Core Design Contradiction:
Stability of the object's compositionVSReliability

Solution Approach 1:

The patent introduces a damping layer comprising a viscoelastic material between the printed circuit board and the housing. This flexible damping layer absorbs mechanical stress and vibrations while maintaining structural stability, preventing damage to sensitive components like ceramic capacitors and quartz crystals during assembly and operation.

Inventive Principle:
Principle #30Flexible shells and thin films

2Adaptability or versatility

If temperature changes occur, then thermal expansion causes dimensional changes, but rigid connections transmit stress to components

Engineering Contradiction:
Improvedimensional compensationVSAvoidmechanical stress
Core Design Contradiction:
Adaptability or versatilityVSStress or pressure

Solution Approach 1:

The viscoelastic damping layer provides dimensional compensation during thermal expansion and contraction cycles. Its flexible nature allows it to deform with temperature-induced dimensional changes while absorbing the resulting mechanical stress, protecting sensitive components from stress damage.

Inventive Principle:
Principle #30Flexible shells and thin films

3Force

If vibrations are transmitted to the circuit board, then mechanical impacts reach sensitive components, but component durability decreases

Engineering Contradiction:
Improveimpact transmissionVSAvoidcomponent lifespan
Core Design Contradiction:
ForceVSDuration of action of stationary object

Solution Approach 1:

The damping layer acts as a pre-positioned cushion between the printed circuit board and housing. It absorbs and dissipates mechanical impacts and vibrations before they can reach sensitive components, thereby extending component lifespan and improving overall system durability.

Inventive Principle:
Principle #11Beforehand cushioning (Prior cushioning)

Solution Approach 2:

The viscoelastic material in the damping layer provides vibration isolation through its flexible, energy-dissipating properties. It converts mechanical vibration energy into heat through internal friction, preventing vibrations from transmitting to and damaging sensitive electronic components.

Inventive Principle:
Principle #30Flexible shells and thin films

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The circuit carrier effectively reduces mechanical stress and vibrations transmitted to sensitive components, enhancing the durability and reliability of battery system control units by providing a flexible connection mechanism that dampens impacts and compensates for dimensional changes.

Implementation Method 1

the third region comprises a spring-like structure that is configured to provide an elastic connection between the first and second regions

Methodology Applied
Scientific EffectElasticity: Elasticity

Implementation Method 2

The circuit carrier effectively reduces mechanical stress and vibrations transmitted to sensitive components, enhancing the durability and reliability

Methodology Applied
Scientific EffectVibration damping: Damping

Data Source

PatentEP3683914B1Circuit carrier for a battery system and battery system
Publication Date: 2024.03.06 SAMSUNG SDI CO LTD
  • EP3683914B1 patent drawingFigure 1~2
  • EP3683914B1 patent drawingFigure 3~4
  • EP3683914B1 patent drawingFigure 5~6

AI summary

The present invention is directed to a circuit carrier (40), preferably of a cell supervision circuit (30) or a battery management system (50), wherein the circuit carrier (40) is configured to be mounted to a battery system (100). Therefore, the circuit carrier (40) has a circuit carrier board (44) with a first region (41) and with a second region (42), wherein the first region (41) is configured to receive a shunt resistor (45) and wherein the second region (42) is configured to receive further electronic components, preferably a voltage measurement circuit. In the circuit carrier (40) of the invention, the first region (41) and the second region (42) are separated from each other by a third region (43) that is configured for forming a flexible connection between the first region (41) and the second region (42) and that comprises a spring-like structure (46) formed from the circuit carrier board (44). Preferably, the spring-like structure (46) comprises at least one meander-shaped structure (47) that connects the first region (41) and the second region (42), wherein the material of the remaining third region (43) is removed, e.g. in a milling process of the circuit carrier (40).