Flexible PCB Using Stacked Teflon Films for Signal Loss Reduction
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Solution Overview
Problem
Conventional flexible printed circuit boards made from polyimide films experience signal loss due to high dielectric loss at high frequency signals and have low heat resistance, leading to defects during surface mount technology processes, while those with low dielectric constant films are expensive and lack competitiveness.
Innovation Solution
A method involving the use of Teflon films with low dielectric constant and high heat resistance, where multiple Teflon sheets are stacked, adhered, and formed into a multi-layer structure with a circuit pattern, using a surface reformed layer or adhesive layer to enhance adhesion and reduce manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a polyimide film is used as the base material, then mechanical strength and heat resistance are improved, but dielectric loss increases causing signal loss at high frequency
Solution Approach 1:
The patent uses a composite structure consisting of a polyimide film base material combined with a low dielectric constant film layer. This composite approach allows the polyimide film to provide mechanical strength and heat resistance while the low dielectric constant film layer reduces dielectric loss and prevents signal loss at high frequencies.
2Loss of energy
If a film with low dielectric constant is used, then dielectric loss is minimized, but melting temperature decreases causing surface melting at high temperature
Solution Approach 1:
The patent creates a composite film structure where a low dielectric constant film is laminated on the polyimide film base material. The polyimide film provides high melting temperature and heat resistance, while the low dielectric constant film provides low dielectric loss. This composite structure prevents surface melting at high temperatures during SMT processes while minimizing dielectric loss.
3Loss of energy
If a low dielectric constant film is used to reduce dielectric loss, then signal loss is minimized, but manufacturing cost increases
Solution Approach 1:
The patent uses a composite structure of polyimide film and low dielectric constant film, where the polyimide film serves as a cost-effective base material that is already widely used in the industry. By adding only a thin low dielectric constant film layer on top, the patent achieves low dielectric loss and signal loss prevention while keeping manufacturing costs relatively low compared to using expensive low dielectric constant films as the entire base material.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach minimizes dielectric loss, prevents deformation and breakage at high temperatures, and reduces manufacturing costs by using Teflon films with improved heat resistance and adhesion properties, resulting in a reliable and cost-effective flexible printed circuit board.
Implementation Method 1
Teflon films with low dielectric constant and high heat resistance
Implementation Method 2
heating, pressing, and adhering a stacked body in which the plurality of base sheets have been stacked
Implementation Method 3
a surface reformed layer or an adhesive layer of a Teflon material formed thereon
Data Source
AI summary
A method for manufacturing a flexible printed circuit board in which base sheets composed of Teflon film having heat resistance and low dielectric constant are stacked to prevent loss of a high frequency signal while minimizing dielectric loss due to the high frequency signal and a flexible printed circuit board manufactured by the same are disclosed. The proposed method for manufacturing a flexible printed circuit board comprises a step of preparing a base sheet which is a Teflon film having a thin film pattern formed on one surface thereof, a step of preparing an adhesive sheet, a step of stacking a plurality of base sheets and adhesive sheets, and a step of heating, pressing, and adhering a stacked body in which the plurality of base sheets and adhesive sheets are stacked.