Flexible PCB Thermal Path in Power Semiconductor Packaging
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Solution Overview
Problem
Conventional power semiconductor devices in electric vehicles face challenges with heat management due to resistive losses, requiring complex and costly cooling techniques, which can lead to performance drops and overheating.
Innovation Solution
A power semiconductor device utilizing a flexible printed circuit board (PCB) positioned between a base metal sheet and the semiconductor, enhancing thermal conductivity and eliminating the need for thermally conductive vertical interconnect access (VIAs), allowing for efficient heat dissipation and cost reduction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional rigid PCBs with thermally conductive VIAs are used, then heat dissipation is achieved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent removes the complex thermally conductive VIA structure from the PCB design. Instead of using traditional rigid PCBs with embedded thermal vias, the invention extracts this function and replaces it with a flexible PCB that achieves heat dissipation through alternative means, thereby simplifying the overall device structure while maintaining thermal management effectiveness
Solution Approach 2:
The patent changes the physical parameters of the PCB by transitioning from a rigid structure to a flexible structure. This parameter change allows the PCB to conform to the semiconductor device geometry and provides alternative thermal pathways without requiring complex via structures, thus reducing device complexity while maintaining heat dissipation capability
2Temperature
If conventional rigid PCBs with thermally conductive VIAs are used, then heat dissipation is achieved, but manufacturing cost increases
Solution Approach 1:
The patent extracts and eliminates the expensive thermally conductive VIA manufacturing process from the PCB fabrication. By using a flexible PCB design that achieves thermal management through simpler means, the invention reduces manufacturing complexity and associated costs while maintaining effective heat dissipation
Solution Approach 2:
The patent employs a flexible PCB that can be manufactured using more cost-effective processes compared to rigid PCBs with thermally conductive VIAs. The flexible nature allows for simpler fabrication steps and potentially lower material costs, making the overall solution more economically viable despite sacrificing some structural rigidity
3Temperature
If complex cooling techniques are used, then overheating is prevented, but device complexity increases
Solution Approach 1:
The patent merges the cooling function directly into the PCB structure itself rather than using separate, complex cooling systems. The flexible PCB is designed to work in conjunction with the semiconductor device, providing thermal management as an integrated function, thereby preventing overheating without adding external cooling components and reducing overall device complexity
Solution Approach 2:
The patent implements a self-service cooling mechanism where the flexible PCB structure itself provides the thermal management functionality. The PCB is designed to conduct heat away from the semiconductor device through its inherent structure and material properties, eliminating the need for additional active cooling systems and reducing device complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution improves cooling performance, reduces thermal resistance, and avoids local overheating, while simplifying connections and reducing costs compared to traditional rigid PCBs.
Implementation Method 1
A power semiconductor device utilizing a flexible printed circuit board (PCB) positioned between a base metal sheet and the semiconductor, enhancing thermal conductivity
Data Source
AI summary
A power semiconductor device includes: a power semiconductor; a base metal sheet; and a flexible printed circuit board (PCB) between the base metal sheet and the power semiconductor. The power semiconductor includes a first power pad on a side facing the flexible PCB, and the flexible PCB includes a conductive pad, one side of which is electrically connected to the first power pad of the power semiconductor and the opposite side of which is electrically connected to the base metal sheet.