Flexible PCB Power Semiconductor Assembly for Lower Thermal Resistance
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Solution Overview
Problem
Conventional power semiconductor devices in electric vehicles face challenges with heat management due to resistive losses, requiring complex and expensive cooling techniques, which can lead to performance drops and overheating.
Innovation Solution
A power semiconductor device utilizing a flexible printed circuit board (PCB) positioned between a base metal sheet and the semiconductor, enhancing thermal conductivity and eliminating the need for thermally conductive vertical interconnect access (VIAs), thereby improving cooling performance and reducing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional rigid PCBs with thermally conductive VIAs are used for power semiconductor devices, then electrical connections are established, but thermal resistance is high and local overheating occurs
Solution Approach 1:
The patent changes the material parameter of the PCB from conventional rigid PCB material to flexible PCB material with superior thermal conductivity. This parameter change enables the flexible PCB to serve dual functions as both electrical interconnect and thermal management solution, reducing thermal resistance without requiring complex VIA structures
Solution Approach 2:
The flexible PCB is designed to perform multiple functions simultaneously: electrical connection between power semiconductor devices and thermal conduction for heat dissipation. This multi-functionality eliminates the need for separate cooling structures and complex thermally conductive VIAs, simplifying the overall device structure
2Temperature
If complex cooling techniques are implemented for heat management, then thermal performance improves, but device complexity and cost increase
Solution Approach 1:
The patent merges the electrical interconnect function and thermal management function into a single flexible PCB structure. By combining these two functions, the design eliminates separate cooling systems and complex VIA structures, achieving effective heat dissipation while reducing overall device complexity
Solution Approach 2:
The flexible PCB acts as an intermediary element that simultaneously handles electrical signal transmission and thermal energy transfer between power semiconductor devices. This intermediary structure provides integrated solutions for both electrical connectivity and thermal management
3Temperature
If conventional rigid PCBs are used, then structural stability is maintained, but thermal conductivity is insufficient and heat dissipation is poor
Solution Approach 1:
The patent changes the material parameters of the PCB, specifically selecting flexible PCB material with high thermal conductivity. This parameter change enables superior heat dissipation performance while the flexible nature provides different mechanical stability characteristics suitable for the power semiconductor device assembly
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces thermal resistance and prevents local overheating, enhancing the reliability and efficiency of power semiconductor devices in high-voltage applications, such as electric vehicles, while simplifying connections and reducing costs compared to conventional rigid PCBs.
Implementation Method 1
A power semiconductor device utilizing a flexible printed circuit board (PCB) positioned between a base metal sheet and the semiconductor, enhancing thermal conductivity
Data Source
AI summary
A power semiconductor device includes: a power semiconductor; a base metal sheet; and a flexible printed circuit board (PCB) between the base metal sheet and the power semiconductor. The power semiconductor includes a first power pad on a side facing the flexible PCB, and the flexible PCB includes a conductive pad, one side of which is electrically connected to the first power pad of the power semiconductor and the opposite side of which is electrically connected to the base metal sheet.