Flexible PCB Foldable Tabs for Ultrasound Array Interconnection
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Solution Overview
Problem
Current ultrasound matrix arrays require thousands of individual electronic channels, leading to high system complexity and cost, as well as cumbersome cabling, which limits their practicality in medical imaging and non-destructive testing applications.
Innovation Solution
The integration of flexible printed circuit boards with foldable tabs and embedded integrated circuits (ICs) allows for a significant reduction in the number of connections and channels, enabling more compact and efficient ultrasound matrix array transducers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If direct IC attachment through vertical architecture with wire bonding is used, then system complexity is reduced, but manufacturing precision and flexibility are limited due to inability to interconnect at fine pitches below 200 μm
Solution Approach 1:
The patent replaces wire bonding (mechanical/physical connection) with a flexible printed circuit board system that uses printed conductive traces for electrical interconnection. This substitution enables fine-pitch interconnections below 200 μm that are not achievable with traditional wire bonding techniques, while maintaining system complexity reduction goals.
Solution Approach 2:
The patent changes the interconnection parameter from wire bonding pitch limitations to printed circuit trace width and spacing, enabling fine-pitch connections. The flexible substrate allows the circuit to adapt to the transducer's fine pitch requirements through its flexibility and conformability.
2Manufacturing precision
If multiple layers of conductor tracks are added to achieve fine pitch interconnection, then interconnection capability is improved, but flexibility of printed circuits is dramatically reduced
Solution Approach 1:
The patent uses a flexible printed circuit board substrate that can conform to the transducer array's fine pitch layout without requiring multiple rigid layers. The flexibility of the thin film substrate allows it to bend and adapt to the required interconnection pattern while maintaining electrical connectivity through printed traces.
3Measurement precision
If thousands of individual electronic channels are used for each transducer element, then measurement precision is improved, but device complexity and cabling requirements become too high for practical use
Solution Approach 1:
The patent merges multiple individual electronic channels into an integrated flexible printed circuit board system. Instead of having separate cabling for each transducer element, the FPCB provides a consolidated interconnection structure that routes signals to and from all elements through integrated conductive traces, dramatically reducing overall system complexity while maintaining individual channel precision.
Data Source
AI summary
A flexible printed circuit board includes a central portion and one or more tabs extending from the central portion. The one or more tabs are foldable relative to the central portion. A plurality of pads are located within the central portion, and the plurality of pads are configured to electrically connect to a transducer. Lands are located within one of the one or more tabs, and electrical traces connect the plurality of pads and the lands. A method of manufacturing an electronics assembly includes providing a flexible printed circuit board with a plurality of central portions and folding the substrate such that the adjacent central portions are vertically stacked and the pads of adjacent central portions are electrically connected. Prior to folding the substrate, a transducer may be affixed to the plurality of pads and one or more electrical components may be affixed to the lands.