Flexible Photosensitive Array for Retinal Implants

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Solution Overview

Problem

Current retinal implant technologies face challenges such as difficult handling during surgery, limited field of vision, and susceptibility to corrosion, due to their rigid and planar design, which can lead to impaired vision and mechanical trauma.

Innovation Solution

A photosensitive array comprising multiple electrically stimulating elements supported by or embedded within a flexible substrate, which facilitates better arrangement and distance between chips, improves handling, and is encapsulated in a soft biocompatible material to protect against damage and enhance post-implantation healing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If a single rigid and planar photosensitive chip is used, then the device structure is simple, but the handling during surgery is difficult and mechanical trauma occurs

Engineering Contradiction:
Improvedevice structureVSAvoidhandling during surgery
Core Design Contradiction:
Device complexityVSEase of operation

Solution Approach 1:

The patent divides the photosensitive chip into multiple smaller chips (e.g., 4x4 array configuration) that can be individually handled and implanted. This segmentation makes the implantation process easier while distributing the mechanical stress, thereby reducing trauma to surrounding tissues.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Multiple photosensitive chips are arranged in a nested or array configuration where smaller chips are positioned within a larger substrate structure. This allows for easier handling of individual chips during surgery while maintaining an organized overall structure.

Inventive Principle:
Principle #7Nested doll (Nesting)

2Ease of manufacture

If a single photosensitive chip is used, then the device is simple to manufacture, but the field of vision is limited

Engineering Contradiction:
Improvemanufacturing simplicityVSAvoidfield of vision
Core Design Contradiction:
Ease of manufactureVSArea of stationary object

Solution Approach 1:

The photosensitive array is divided into multiple chips arranged in a grid pattern (e.g., 4 rows and 4 columns), where each chip contributes to a portion of the overall field of vision. This segmentation allows the system to cover a wider visual area while maintaining manufacturing simplicity through standardized chip production.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent transitions from a single-planar chip to a multi-chip array configuration that expands the functional area in both lateral dimensions. This dimensional expansion increases the field of vision coverage while maintaining a planar overall structure that is relatively simple to manufacture.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Stability of the object's composition

If a rigid planar chip is used, then the structural stability is good, but the chip shifts out of place after implantation

Engineering Contradiction:
Improvestructural stabilityVSAvoidposition stability after implantation
Core Design Contradiction:
Stability of the object's compositionVSReliability

Solution Approach 1:

The rigid planar chip is segmented into multiple smaller chips that are individually positioned and secured. This segmentation allows each chip to be more precisely placed and stabilized, reducing the likelihood of shifting while maintaining overall structural integrity through the array configuration.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent employs flexible substrates or thin film structures that can conform to the curvature of the retina while providing structural support. This flexibility allows the chips to be securely positioned without rigid constraints that could cause shifting, while maintaining adequate structural stability.

Inventive Principle:
Principle #30Flexible shells and thin films

4Device complexity

If a single chip is used, then the device complexity is low, but the chip is prone to corrosion from environmental liquids

Engineering Contradiction:
Improvedevice structureVSAvoidcorrosion resistance
Core Design Contradiction:
Device complexityVSReliability

Solution Approach 1:

The single chip is divided into multiple smaller chips, each with its own protective encapsulation. This segmentation allows for individual protection of each chip from corrosion, and if one chip becomes compromised, the others remain functional, thereby improving overall reliability without significantly increasing device complexity.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Each photosensitive chip is encapsulated in a flexible protective shell or thin film barrier that prevents direct contact with environmental liquids and corrosive substances. This encapsulation protects the chip materials from corrosion while maintaining the overall device structure relatively simple.

Inventive Principle:
Principle #30Flexible shells and thin films

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The substrate-supported photosensitive array provides improved handling and therapeutic benefits by reducing mechanical trauma, enhancing the field of vision, and preventing corrosion, thus providing a more effective and durable retinal implant solution.

Implementation Method 1

capable of receiving an image projected by an extraocular device (typically a camera and a microelectronic circuit for decoding incident light) onto the retina through the lens of the eye, for converting the image into electrical signals

Methodology Applied
Scientific EffectPhotoelectric effect: Photoelectric Effect

Data Source

PatentUS11559684B2Photosensitive array
Publication Date: 2023.01.24 SCIENCE CORPORATION
  • US11559684B2 patent drawing
  • US11559684B2 patent drawing
  • US11559684B2 patent drawing

AI summary

The present invention relates to photosensitive arrays comprising a plurality of photosensitive elements disposed in or on a suitable substrate. The photosensitive arrays are useful as implants, in particular as retinal implants. Methods for manufacturing such arrays are also provided.