Flexible Piezoelectric Transducer Array for Curved Surfaces

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Solution Overview

Problem

Existing transducer arrays struggle to accommodate surfaces with small radii of curvature, limiting their flexibility and effectiveness in applications such as intravascular ultrasound and endoscopic ultrasound, where they need to operate on non-planar surfaces with tight radii of curvature.

Innovation Solution

The development of flexible piezoelectric transducer arrays with microelectromechanical system (MEMS) structures that can be flexed to accommodate radii of curvature as small as 1 mm, integrated with a flexible polymer layer for signal transmission and electrical interconnects, allowing for operation on curved surfaces.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If transducer arrays are designed with rigid structures to maintain dimensional stability and manufacturing precision, then manufacturing precision is improved, but adaptability to surfaces with small radii of curvature deteriorates

Engineering Contradiction:
Improvedimensional tolerancesVSAvoidflexibility on curved surfaces
Core Design Contradiction:
Manufacturing precisionVSAdaptability or versatility

Solution Approach 1:

The patent employs thin film structures and flexible interconnect layers that allow the transducer array to bend and conform to curved surfaces while maintaining the precision of the piezoelectric elements themselves. The flexible substrate and interconnect architecture enable the array to adapt to small radii of curvature without compromising the dimensional stability of the active transducer components.

Inventive Principle:
Principle #30Flexible shells and thin films

Solution Approach 2:

The transducer array is divided into modular elements with flexible interconnects between them, allowing each segment to maintain its precise dimensions while the overall structure can flex and conform to curved surfaces. This segmentation enables the array to bend without inducing stress that would compromise the dimensional tolerances of individual transducer elements.

Inventive Principle:
Principle #1Segmentation

2Adaptability or versatility

If transducer arrays are made flexible to accommodate small radii of curvature, then adaptability is improved, but structural stability and reliability deteriorate

Engineering Contradiction:
Improveflexibility on curved surfacesVSAvoidstructural stability
Core Design Contradiction:
Adaptability or versatilityVSReliability

Solution Approach 1:

The patent uses flexible thin film interconnect layers and substrates that provide both the necessary flexibility for conforming to curved surfaces and sufficient structural integrity to maintain reliable electrical connections and mechanical stability during operation.

Inventive Principle:
Principle #30Flexible shells and thin films

Solution Approach 2:

The transducer array incorporates composite structures combining flexible polymer layers with rigid piezoelectric elements and conductive interconnects, creating a hybrid architecture that provides both flexibility for curvature adaptation and structural stability for reliable operation.

Inventive Principle:
Principle #40Composite materials

3Ease of manufacture

If transducer arrays are designed for planar surfaces to maintain simple geometry and ease of manufacture, then ease of manufacture is improved, but adaptability to non-planar surfaces deteriorates

Engineering Contradiction:
Improvefabrication simplicityVSAvoidconformability to non-planar surfaces
Core Design Contradiction:
Ease of manufactureVSAdaptability or versatility

Solution Approach 1:

The patent employs flexible thin film substrates and interconnect layers that can be manufactured using standard thin film deposition and patterning techniques, then subsequently bent or formed to conform to non-planar surfaces, combining manufacturing simplicity with geometric adaptability.

Inventive Principle:
Principle #30Flexible shells and thin films

Solution Approach 2:

The transducer array is designed with flexible components that allow it to dynamically adapt its geometry from a flat manufactured state to various curved configurations during deployment, enabling easy manufacture followed by adaptable deployment on non-planar surfaces.

Inventive Principle:
Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables transducer arrays to conform to small radii of curvature, enhancing their operational flexibility and effectiveness in medical imaging and other applications by allowing for flexible mounting and repositioning on non-planar surfaces.

Implementation Method 1

The same piezoelectric membrane can also receive reflected pressure waves from the propagation media and convert the received pressure waves into electrical signals

Methodology Applied
Scientific EffectPiezoelectric effect: Piezoelectric Effect

Implementation Method 2

The same piezoelectric membrane can also receive reflected pressure waves from the propagation media and convert the received pressure waves into electrical signals

Methodology Applied
Scientific EffectPiezoelectric effect: Converse Piezoelectric Effect

Data Source

PatentUS10586912B2Method for fabricating flexible micromachined transducer device
Publication Date: 2020.03.10 FUJIFILM DIMATIX INC
  • US10586912B2 patent drawing
  • US10586912B2 patent drawing
  • US10586912B2 patent drawing

AI summary

A plurality of transducer elements are formed. For each of the plurality of transducer elements, an electrode of the transducer element is formed on a first side of a support layer. A piezoelectric element of the transducer element is formed on the first side of the support layer. An interconnect of the transducer element is formed in the support layer. The support layer is thinned to expose a second side of the support layer. The interconnects of the plurality of transducer elements extend between the first side and the second side of the support layer. The second side of the support layer is bonded to a flexible layer with an adhesive material. Conductive fillers are disposed in the adhesive material. The interconnects of the plurality of transducer elements are each electrically coupled via the conductive fillers to the corresponding interconnect extending through the flexible layer.