Flexible Contact Temperature Sensing for Insulated Pin Connectors

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Solution Overview

Problem

Existing temperature measurement systems for pin-shaped electrical contact elements in electromobility applications face challenges in accurately detecting temperature increases due to limited heat flow and mechanical robustness, which can lead to overheating and reduced charging or drive power in electric vehicles.

Innovation Solution

A temperature measuring device comprising a flexible circuit board with a thermally conducting and electrically insulating substrate layer and a heat-conducting sensor surface, allowing for high dynamic and insulated temperature measurement by maximizing heat flow and mechanical flexibility, while maintaining electrical insulation and scalability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If heat-conducting elements are used to measure temperature by abutting against the contact element, then temperature measurement is possible, but electrical insulation is compromised and thermal mass is too large for dynamic measurement

Engineering Contradiction:
Improvetemperature measurement capabilityVSAvoidelectrical insulation
Core Design Contradiction:
Measurement precisionVSReliability

Solution Approach 1:

The device separates the thermal conduction function from the electrical conduction function by using distinct layers: the first substrate layer handles thermal conduction while the second layer handles electrical conduction and sensor placement, allowing independent optimization of each function

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The first substrate layer acts as an intermediary element that thermally couples the contact element to the sensor while electrically isolating them, enabling temperature transfer without electrical current interference

Inventive Principle:
Principle #24Intermediary (Mediator)

2Measurement precision

If a large contact surface is used to improve heat flow, then thermal measurement accuracy improves, but the device becomes less adaptable to different contact element sizes

Engineering Contradiction:
Improveheat flow detectionVSAvoidscalability to different contact elements
Core Design Contradiction:
Measurement precisionVSAdaptability or versatility

Solution Approach 1:

The flexible circuit board substrate allows the device to conform to different contact element geometries and sizes while maintaining optimal thermal contact surface area, enabling both high measurement precision and adaptability across various pin configurations

Inventive Principle:
Principle #30Flexible shells and thin films

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enables rapid and reliable detection of temperature increases with improved heat flow and mechanical robustness, ensuring efficient monitoring of pin-shaped electrical contact elements, thus preventing overheating and maintaining high performance in electromobility applications.

Implementation Method 1

a first thermally conducting and electrically insulating substrate layer with a contact surface that is configured to lie flat against a flange of the pin-shaped electrical contact element

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

a sensor element connected to the sensor surface, which sensor element is configured to record a temperature of the pin-shaped electrical contact element

Methodology Applied
Scientific EffectTemperature sensing: Thermistor

Data Source

PatentUS20230358615A1Temperature measuring device
Publication Date: 2023.11.09 LISA DRAXLMAIER GMBH
  • US20230358615A1 patent drawing
  • US20230358615A1 patent drawing
  • US20230358615A1 patent drawing

AI summary

The present disclosure relates to a temperature measuring device for measuring a temperature of a pin-shaped electrical contact element, which includes a flexible circuit board with a first thermally conducting and electrically insulating substrate layer. The first substrate layer includes a contact surface that is configured to lie flat against a flange of the pin-shaped electrical contact element and an opening disposed in the contact surface. The pin-shaped electrical contact element is disposed at least partially in the opening. The flexible circuit board further includes a second thermally and electrically conducting layer that is disposed on a sensor surface opposite the contact surface of the first substrate layer and includes a sensor element connected to the sensor surface. The sensor element is configured to record a temperature of the pin-shaped electrical contact element when the pin-shaped electrical contact element is at least partially disposed in the opening.