Flexible Pins for Multi-Level Via Interconnection in Validation Boards
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Solution Overview
Problem
The conventional Design Validation (DV) process for semiconductor devices is costly and time-consuming due to the need for multiple expensive validation boards, such as Modular Design Vehicle (MDV) and Design Validation Platform (DVP) boards, especially when testing high-speed signals, which requires separate boards for different connectors, leading to increased development time and complexity.
Innovation Solution
A multiple-interconnection system using flexible pins that couple to multi-level vias on a single validation board, allowing connection of high-speed signals to both differently formatted connectors without the need for separate boards, by actuating pins to switch between connectors without signal degradation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple separate validation boards are used for different connectors, then signal integrity is maintained, but device complexity and development cost increase
Solution Approach 1:
The patent combines multiple validation board functionalities into a single integrated validation board by using flexible pins that can be actuated to connect to different via levels. This merging approach maintains signal integrity for high-speed signals while reducing the number of separate boards needed, thereby decreasing device complexity and development cost.
Solution Approach 2:
The patent employs dynamically reconfigurable flexible pins that can be actuated between different positions to connect to either the first via level or the second via level. This dynamic capability allows a single validation board to serve multiple connector types and configurations, replacing the need for multiple static validation boards.
2Reliability
If multiple separate validation boards are used for different connectors, then connector-specific validation is achieved, but development time increases
Solution Approach 1:
The validation board is designed with universal functionality to support multiple connector types through the use of flexible pins that can be actuated to different via levels. Each via level is configured for different connector types, allowing a single board to perform connector-specific validation for multiple interfaces, thereby reducing development time while maintaining validation effectiveness.
3Device complexity
If flexible pins are used to connect to multi-level vias, then the number of validation boards is reduced, but manufacturing precision requirements increase
Solution Approach 1:
The patent implements a nested structure where multiple via levels are vertically stacked within the validation board, with each via level serving a specific connector type. The flexible pins are designed to navigate through insulative material and make precise contact with conductive material at specific via levels. This nested via configuration allows reduced board quantity while managing manufacturing precision through structured vertical integration.
4Adaptability or versatility
If flexible pins are actuated to switch between connectors, then adaptability is improved, but mechanical complexity increases
Solution Approach 1:
The patent uses flexible pins with resilient arms that can be actuated to change position and connect to different via levels. The flexible structure of the pins allows them to bend and make contact with conductive material at either the first or second via level, providing adaptability for different connector types while using a relatively simple mechanical actuation approach.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables connection of twice the number of high-speed signals to a semiconductor device in a single validation board, reducing development time and cost by eliminating the need for multiple boards and maintaining signal integrity.
Implementation Method 1
each of the first and second arms are resiliently biased away from and each other
Data Source
AI summary
An embodiment includes a system comprising: a polymer substrate including a plurality of voids; and a plurality of metal pins; wherein a first pin, included within the plurality of metal pins, includes: (a)(i) first and second arms that couple to each other by way of an arcuate member, (a)(ii) a middle portion including a middle diameter, a proximal portion including a proximal diameter, and a distal portion including a distal diameter; wherein (b)(i) the middle portion is between the proximal and distal portions, (b)(ii) the middle diameter is less than the proximal and distal diameters, and (b)(iii) the proximal portion, but not the distal portion, is included within one of the plurality of voids. Other embodiments are described herein.