Flexible Polyimide Flextape LED Package Thermal Management
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Solution Overview
Problem
High-intensity LEDs generate excessive heat and are costly to produce, necessitating effective thermal management and cost reduction in LED packaging solutions.
Innovation Solution
The LED package incorporates a flexible polyimide circuit (flextape) with metal traces connected to the LED die, integrated with a thermally conductive base and a retaining ring, allowing for efficient heat dissipation and electrical isolation, while enabling a cost-effective manufacturing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If high-intensity LEDs are used to generate more light, then illumination intensity is improved, but heat generation increases and manufacturing cost increases
Solution Approach 1:
The patent extracts the thermal management function from the traditional LED package by using a separate heat sink structure that is thermally coupled to the LED die. The heat sink is designed with extended surfaces and thermal vias to efficiently conduct heat away from the high-intensity LED die, allowing the LED to operate at higher power levels without excessive temperature rise.
Solution Approach 2:
The patent employs composite material structures including metal core PCBs with copper layers, epoxy resin encapsulants, and heat sink materials with high thermal conductivity. These composite materials provide both mechanical support and thermal management functions, enabling effective heat dissipation while maintaining structural integrity for high-intensity LED operation.
2Illumination intensity
If high-intensity LEDs are used to generate more light, then illumination intensity is improved, but manufacturing cost increases
Solution Approach 1:
The patent designs a multi-functional LED package structure where the substrate serves simultaneously as mechanical support, electrical connection carrier, and thermal management component. The integrated design combines the LED mounting area, electrical trace layers, and heat dissipation pathways into a single unified structure, reducing the number of separate components and assembly steps required, thereby lowering manufacturing cost for high-intensity LEDs.
Solution Approach 2:
The patent segments the LED package into modular functional regions including the LED die mounting area, electrical connection zones with metal traces, heat sink attachment areas, and encapsulant regions. This segmentation allows for standardized manufacturing processes and facilitates automated assembly, reducing overall manufacturing cost despite the high-performance requirements.
3Ease of manufacture
If traditional LED packaging is used, then manufacturing is simple, but heat dissipation is insufficient
Solution Approach 1:
The patent merges multiple functions into the LED package structure: the substrate integrates electrical connection traces with thermal conduction pathways, the encapsulant provides both optical protection and thermal management, and the heat sink is thermally coupled to the LED die through the substrate. This merged design maintains manufacturing simplicity while achieving superior heat dissipation compared to traditional separate-component approaches.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances heat dissipation and electrical performance, reducing manufacturing costs and improving the reliability of high-intensity LED packages by using a flexible polyimide circuit and a thermally conductive base, facilitating both thermal and electrical functions within a single package.
Implementation Method 1
a thermally conductive base and a retaining ring, allowing for efficient heat dissipation
Implementation Method 2
The flextape includes at least one metal trace connected to the light emitting die
Data Source
AI summary
A light emitting diode (LED) package may include a base, at least one light emitting die on the base, and a flextape on the base. The flextape includes at least one metal trace connected to the light emitting die. In a method of manufacturing the LED package, the base may be formed so as to include a basin and at least one light emitting die may be placed within the basin. The flextape may be provided to include at least one metal trace that is electrically connected to the light emitting die.