Flexible Polyimide X-ray Detector Detachment
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Solution Overview
Problem
The detachment and re-lamination process of polyimide-based X-ray detector panels on flexible substrates often results in unacceptable performance and defect levels, making it challenging to identify and avoid further assembly steps for defective panels, which increases costs and compromises test verification methods.
Innovation Solution
A flexible digital radiographic image sensor array is formed on a first substrate with a second flexible substrate attached, featuring a top surface with a selective adhesive portion beneath the image sensor array, allowing for detachment and re-attachment onto a secondary substrate using methods like laser exposure or mechanical peeling, while maintaining geometric integrity and improved handling characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If detachment and re-lamination process is performed on polyimide-based X-ray detector panels, then flexible substrate configuration and improved durability are achieved, but unacceptable performance and defect levels occur
Solution Approach 1:
The patent divides the substrate system into multiple functional layers: a polyimide flexible substrate containing the image sensor array, a release layer for temporary attachment, and a secondary substrate for final mounting. This segmentation allows the polyimide layer to be detached and re-laminated independently, enabling flexible configurations while maintaining sensor integrity and reducing defects through controlled separation interfaces.
2Shape
If detachment and re-lamination process is performed, then non-planar or curved configurations are enabled, but test verification accuracy and assembly quality deteriorate
Solution Approach 1:
The patent performs test verification and module assembly steps on the polyimide substrate while it is still attached to the rigid secondary substrate, which provides stable geometric reference and planar configuration. After verification is complete, the polyimide layer is detached and configured into non-planar or curved shapes for final deployment, ensuring that measurement precision is maintained during testing while flexibility is achieved in the final product.
3Weight of moving object
If detachment and re-lamination is performed to improve portability, then weight reduction is achieved, but subsequent module assembly steps become problematic
Solution Approach 1:
The patent performs all module assembly steps including scintillator lamination, chip-on-film attach, and probe testing while the polyimide substrate is still supported by the rigid secondary substrate. This preliminary assembly on a stable platform ensures manufacturing precision and ease of assembly, after which the lightweight polyimide detector is detached for portable deployment, combining ease of manufacture with weight reduction.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables reliable evaluation and assembly of digital radiographic core imaging subsystem modules with reduced defects, improving the accuracy of test verification and subsequent module assembly steps, and enhances the durability and portability of X-ray detectors.
Implementation Method 1
The second substrate has a top surface with an adhesive thereon for attaching the substrates together
Implementation Method 2
The typical detach method may include laser ablation or mechanical release
Data Source
AI summary
An image sensor array formed on a flexible first substrate is supported by a flexible second substrate attached thereto. The second substrate has a top surface with an adhesive thereon for attaching the substrates together. The adhesive is on a portion of the second substrate directly beneath the image sensor array to allow selective formation of the second substrate.