Flexible Power Stage Package With Stacked Die for Fast Switching
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Solution Overview
Problem
Intelligent power modules have limited integration and speed due to the separation of power switches and control die components, which results in increased impedance in the control signal loop, limiting the speed of control signals and switching efficiency.
Innovation Solution
A semiconductor package design that integrates a power stage and control die on opposing surfaces of a flexible circuit, with the power stage physically and thermally coupled to a substrate for conductive cooling, and a ground return path within the package to reduce signal impedance, facilitating higher frequency communications.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If power switches and control die components are separated in intelligent power modules, then ease of manufacture is improved, but signal impedance increases and switching speed decreases
Solution Approach 1:
The patent combines power switches and control die components into a single integrated power stage package, eliminating the separation between power and control components. This integration reduces the control signal loop impedance and enables faster switching speeds while maintaining ease of manufacture through a unified packaging approach.
2Device complexity
If power switches and control die components are separated, then device complexity is reduced, but control signal loop impedance increases
Solution Approach 1:
The patent merges power switches and control die components into an integrated power stage, reducing the physical separation and associated impedance in the control signal loop. This integration improves signal quality and reduces electromagnetic interference while maintaining manageable device complexity through systematic packaging.
3Ease of manufacture
If discrete components are assembled on metal leadframe, then ease of manufacture is improved, but heat dissipation efficiency decreases
Solution Approach 1:
The patent combines multiple discrete components into an integrated power stage package with unified thermal management. The integrated design enables more efficient heat dissipation through direct thermal coupling and optimized thermal pathways, while maintaining ease of manufacture through standardized packaging processes.
4Device complexity
If components are overmolded as a unit, then device complexity is reduced, but cooling efficiency decreases
Solution Approach 1:
The patent applies local quality by providing dedicated cooling pathways and thermal management structures specifically for heat-generating power components within the integrated package. The design includes direct thermal coupling to heat sinks and optimized thermal interfaces, ensuring efficient heat dissipation while maintaining the benefits of integrated packaging.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The integration of power and control dies within a single package with a flexible circuit and substrate reduces signal impedance, enabling faster switching and higher frequency communications, particularly beneficial for gallium nitride (GaN) dies, while also improving cooling efficiency for high-voltage applications.
Implementation Method 1
The semiconductor die is physically and thermally coupled to a substrate opposite the flexible circuit to facilitate conductive cooling from the semiconductor die
Data Source
AI summary
A semiconductor package includes a substrate, a set of terminals protruding from a first surface of the substrate, a power stage physically and thermally coupled to the first surface of the substrate, and a flexible circuit including at least one circuit layer forming power stage conductors and control circuit conductors disposed on a flexible insulating substrate layer. The power stage is between the flexible circuit and the substrate and is mounted on a first surface of the flexible circuit such that the power stage is electrically connected to the power stage conductors. The package includes a die mounted on a second surface of the flexible circuit opposite the power stage. An output of the die is electrically connected to an input of the power stage via the control circuit conductors.