Flexible Substrate Pressing for Bubble-Free LED Component Transfer
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Solution Overview
Problem
Conventional methods for transferring semiconductor components from a transfer substrate to a target substrate often result in residual air bubbles, which negatively impact the yield of the final product, such as light-emitting diode displays.
Innovation Solution
An apparatus and method that utilize a flexible push generator, including an inflatable air bag, to apply a greater push force centrally on the substrates, pushing air bubbles towards the edges and allowing them to be discharged, while a laser beam is used to bond the components, ensuring even pressing and improved contact between substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional direct pressing method is used to transfer semiconductor component, then the transfer substrate and target substrate can be aligned and pressed, but residual air bubbles remain between the surfaces affecting yield
Solution Approach 1:
The patent changes the pressure distribution parameter from uniform to non-uniform. The flexible push generator applies greater pressure to the central portion of the substrates than to the peripheral portion, creating a pressure gradient that forces air bubbles toward the edges where they can be discharged. This parameter change resolves the contradiction by improving contact quality while eliminating air bubbles that reduce yield.
Solution Approach 2:
The patent replaces the conventional rigid mechanical pressing system with a flexible push generator system. Instead of using a rigid press that applies uniform force, the invention uses a flexible mechanism that can adapt to substrate variations and create the desired non-uniform pressure distribution, thereby improving both contact quality and bubble removal.
2Device complexity
If uniform pressure is applied across the substrate surfaces, then the pressing mechanism is simple, but air bubbles cannot be effectively removed
Solution Approach 1:
The patent introduces a non-uniform pressure distribution parameter where the central portion receives greater pressure than the peripheral portion. This is achieved through the flexible push generator's specific configuration and control, creating a pressure gradient that naturally directs air bubbles toward the edges for discharge, thereby improving yield without requiring overly complex mechanisms.
Solution Approach 2:
The patent adds a spatial dimension to the pressure application by varying pressure across different regions of the substrate (central vs. peripheral portions). This dimensional approach to pressure distribution enables effective bubble removal while maintaining relatively simple device architecture.
3Reliability
If the flexible push generator applies greater force to the central portion than the peripheral portion, then air bubbles are pushed to edges for discharge, but the pressing mechanism becomes more complex
Solution Approach 1:
The patent employs flexible push generators that utilize flexible shells or thin films to achieve the non-uniform pressure distribution. These flexible elements can conform to substrate variations and create the required pressure gradient (greater force centrally, lesser force peripherally) through their inherent flexibility and controlled deformation, rather than requiring complex rigid mechanical structures.
Solution Approach 2:
The flexible push generator controls the pressure parameter to vary spatially across the substrate surface. By adjusting the flexibility and deformation characteristics of the push generator, the system achieves optimal pressure distribution for bubble removal without requiring complex mechanical linkages or multiple actuators.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively removes residual air bubbles between substrates, enhancing the manufacturing yield and ensuring accurate bonding of electronic components, thereby improving the production process and reducing defects in light-emitting diode displays.
Implementation Method 1
the flexible push is in a greater magnitude onto a central portion of the target substrate or of the transfer substrate than onto a peripheral portion of the target substrate or of the transfer substrate at the start of the flexible push being applied
Implementation Method 2
a laser beam is used to bond the components
Data Source
AI summary
An apparatus configured to transfer an electronic component, including a first carrier, a second carrier, an actuator mechanism, and a flexible push generator, is provided. The first carrier is configured to carry a target substrate. The second carrier is configured to carry a transfer substrate. The actuator mechanism is configured to actuate the first and second carriers to move close to and away from each other. The flexible push generator generates a flexible push to the carried target substrate or transfer substrate when the first and second carriers move close to each other. When the flexible push is starting to be generated, a flexible push generated on a central area of the target substrate or the transfer substrate is greater than that on a surrounding area. A method for bonding an electronic component and a method for manufacturing a light-emitting diode display are also provided.