Flexible Pressure-Sensing Circuit With Piezoelectric Vibration Feedback
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Solution Overview
Problem
Flexible pressure sensitive touch technology in electronic devices often lacks sufficient displacement feedback, making it difficult for users to confirm button presses.
Innovation Solution
A pressure sensing flexible circuit board integrating a pressure sensing element and a vibrating element on a flexible circuit substrate, utilizing a multi-layer piezoelectric structure and metal particles as interlayer electrical conductors to enhance displacement and vibration resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If flexible pressure sensitive touch technology is used, then the device can detect pressure input, but the displacement is too small for users to certainly sense button presses
Solution Approach 1:
The patent introduces a vibrating element that generates mechanical vibrations when pressure is applied. This vibration feedback mechanism amplifies the displacement sensation, allowing users to clearly perceive button presses despite the small actual displacement of the pressure-sensitive layer. The vibration is transmitted through the flexible circuit substrate to the user's finger, providing tactile feedback that resolves the contradiction between small displacement and user sensing capability.
2Reliability
If a multi-layer piezoelectric structure is used, then vibration resistance and displacement feedback are enhanced, but manufacturing complexity increases
Solution Approach 1:
The patent divides the piezoelectric component into multiple stacked layers, each contributing to the overall vibration resistance and displacement feedback. The multi-layer structure segments the mechanical stress and electrical fields, allowing each layer to optimize its piezoelectric effect while collectively providing enhanced performance. This segmentation approach manages complexity by modularizing the design.
Solution Approach 2:
The patent employs composite materials combining piezoelectric ceramics or polymers with conductive layers and encapsulation materials. This composite structure integrates multiple functions (vibration generation, electrical conduction, mechanical protection) into a single multi-layer assembly, reducing overall device complexity while enhancing reliability through the synergistic properties of different materials.
3Reliability
If metal particles are used as interlayer electrical conductors, then electrical conductivity and vibration resistance are improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent optimizes parameters such as particle size, concentration, and distribution of metal particles within the piezoelectric layers. By controlling these parameters, the patent achieves sufficient electrical conductivity and vibration resistance while reducing the stringency of manufacturing precision requirements. The particle parameters are selected to ensure reliable electrical pathways even with typical manufacturing variations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides greater displacement feedback and energy savings by using a multi-layer piezoelectric structure with metal particles, enhancing vibration resistance and reducing energy consumption.
Implementation Method 1
The pressure sensing element includes a first piezoelectric layer; plural first interlayer electrical conductors dispersed within the first piezoelectric layer
Implementation Method 2
The vibrating element includes a multi-layer piezoelectric structure; Each layer of the multi-layer piezoelectric structure includes a second piezoelectric layer
Data Source
AI summary
A pressure sensing flexible circuit board and a method of fabricating the same are provided. The pressure sensing flexible circuit board includes a flexible circuit substrate and a pressure sensing element and a vibrating element disposed on the flexible circuit substrate. The pressure sensing element includes a first piezoelectric layer; plural first interlayer electrical conductor dispersed within the first piezoelectric layer; a first polymer layer adjacent to the first piezoelectric layer; and a first electrode layer disposed on the first piezoelectric layer. The vibrating element includes a multi-layer piezoelectric structure; a second electrode layer disposed on the multi-layer piezoelectric structure; and a second polymer layer adjacent to the multi-layer piezoelectric structure. Each layer of the multi-layer piezoelectric structure includes a second piezoelectric layer and plural second interlayer electrical conductor dispersed within the second piezoelectric layer.