Flexible printed circuit

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Solution Overview

Problem

Existing flexible printed circuit technologies face limitations in size customization, attachment of small high-tolerance electrical components, and efficient connection methods, particularly for large flexible conductive circuits used in Point of Purchase displays and beyond.

Innovation Solution

A flexible printed circuit with a conductive substrate and circuit formed by vacuum deposition and electrical discharge machining, utilizing registration placement circuits, butterfly connectors, conductive cloth or metal foil connections, and dielectric insulating layers to enable attachment and connection of components, and accommodate various sizes and configurations.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Area of stationary object

If a large flexible conductive circuit is manufactured using current flexible printed circuit board technology, then the circuit can be made large, but the manufacturing cost increases significantly and size is limited to approximately 14 inches×16 inches

Engineering Contradiction:

Improvesize of flexible conductive circuitVSAvoidmanufacturing cost and feasibility

Core Design Contradiction:

Area of stationary objectVSEase of manufacture

Solution Approach 1:

The circuit board is divided into a flexible supporting substrate and a separate conductive material layer. The conductive material is deposited onto the substrate and then cut into circuit patterns, allowing large areas to be manufactured by processing the substrate and conductive material separately and assembling them together.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent combines the flexible supporting substrate with the conductive material layer to create a hybrid structure. This merging allows the circuit to achieve large sizes by leveraging the advantages of both materials - the flexibility and large-area capability of the substrate combined with the conductive properties of the separate material layer.

Inventive Principle:

Principle #5Merging (Combining)

2Adaptability or versatility

If extremely small high tolerance electrical components are attached to a large flexible conductive circuit, then the circuit functionality is enhanced, but the attachment process becomes difficult

Engineering Contradiction:

Improvecircuit functionalityVSAvoidattachment process difficulty

Core Design Contradiction:

Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

Registration placement circuits are created in advance on the flexible supporting substrate before the final circuit assembly. These pre-formed registration marks and placement areas provide precise guides for attaching small electrical components, making the attachment process easier and more accurate.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The registration placement circuits serve as an intermediary structure between the large flexible conductive circuit and the small electrical components. This intermediary provides a standardized interface with registration marks and placement areas that facilitate precise component attachment to the otherwise difficult-to-target small components on a large circuit.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Ease of operation

If the flexible supporting substrate is made to be rollable or foldable for storage, then space efficiency is improved, but the structural integrity and connection reliability may be compromised

Engineering Contradiction:

Improvestorage efficiencyVSAvoidconnection reliability

Core Design Contradiction:

Ease of operationVSReliability

Solution Approach 1:

The patent uses a flexible supporting substrate made from thin film materials that can be rolled or folded for storage. This flexible substrate maintains its structural integrity through repeated bending and rolling while supporting the conductive circuit and electrical components, enabling compact storage without compromising connection reliability.

Inventive Principle:

Principle #30Flexible shells and thin films

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables flexible and customizable conductive circuits that can be rolled, folded, or segmented, supporting a wide range of applications with reliable connections and efficient power input, overcoming size and attachment challenges while maintaining cost-effectiveness and environmental sustainability.

Implementation Method 1

A conductive material is deposited by vacuum deposition on at least one of the first face or the second face of the flexible supporting substrate

Methodology Applied

Scientific EffectVacuum deposition: Physical Vapour Deposition

Implementation Method 2

A flexible conductive circuit is formed on the conductive material by electrical discharge machining

Methodology Applied

Scientific EffectElectrical discharge machining: Electrical Discharge Machining

Data Source

PatentUS10462906B2Flexible printed circuit

Publication Date: 2019.10.29 TF MASSIF TECH LTD

AI summary

A flexible printed circuit is described that includes a flexible supporting substrate having a first face and a second face. A conductive material is deposited by vacuum deposition on at least one of the first face or the second face of the flexible supporting substrate. A flexible conductive circuit is formed on the conductive material by electrical discharge machining. The flexible conductive circuit defines a plurality of electrical component placement circuits to which electrical components may be attached. The flexible printed circuit can be rolled or folded. The flexible printed circuit can also be made in sizes much larger than is currently possible with other competing technologies.