Flexible Printed Electronics Attenuation Assembly for MRI-Compatible Implants
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Solution Overview
Problem
Implantable medical devices are often incompatible with magnetic resonance imaging (MRI) due to the interference caused by MRI's radiofrequency (RF) energy, leading to potential tissue damage and heating issues.
Innovation Solution
The implementation of a flexible printed electronics (FPE) assembly-based attenuation arrangement that dissipates and shields RF energy, reducing its coupling onto conductive elements within the implantable device, thereby minimizing energy deposition and heating.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If implantable medical devices are placed in the body, then therapeutic function is provided, but the devices are incompatible with MRI due to RF energy interference causing tissue damage and heating
Solution Approach 1:
The patent introduces an attenuation arrangement as an intermediary component between the implantable medical device and the MRI RF energy field. This arrangement includes conductive elements and insulators configured to intercept and dissipate RF energy before it can couple onto the device's conductive elements, thereby protecting the device and surrounding tissues from harmful heating effects while allowing the device to maintain its therapeutic function
Solution Approach 2:
The attenuation arrangement converts the harmful RF energy that would otherwise cause heating and damage into a beneficial protective mechanism. By strategically placing conductive elements that resonate at MRI frequencies, the system creates controlled current paths that dissipate RF energy through resistive heating in designated areas away from sensitive tissues, effectively transforming the harmful RF coupling into a protective shielding effect
2Reliability
If traditional shielding components are added to protect against RF energy, then MRI compatibility is improved, but device complexity and component count increase
Solution Approach 1:
The attenuation arrangement integrates multiple functions into a single component structure. The conductive elements serve both as part of the device's electrical circuitry and as RF attenuation elements, while the insulators provide both electrical isolation and mechanical support. This multi-functionality reduces the need for separate shielding components, maintaining MRI compatibility without significantly increasing overall device complexity
Solution Approach 2:
The patent merges the attenuation function with the existing device structure by incorporating conductive elements and insulators that are already part of the device's lead or housing assembly. Rather than adding separate shielding layers, the design combines RF protection functionality with the device's existing components, thereby achieving MRI compatibility while minimizing increases in component count and structural complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The attenuation arrangement enables MRI compatibility by ensuring safe RF energy levels are maintained, protecting the device and surrounding tissues from damage while simplifying manufacturing and reducing component count.
Implementation Method 1
an attenuation arrangement to attenuate radiofrequency (RF) energy, such as magnetic resonance imaging (MRI) energy, relative to the at least one conductive element
Implementation Method 2
The attenuation arrangement enables MRI compatibility by ensuring safe RF energy levels are maintained, protecting the device and surrounding tissues from damage
Data Source
AI summary
An implantable medical device includes at least one conductive element and an associated attenuation arrangement to attenuate MRI energy.