Flexible Electric Probe Offset Conductors Thin Film Measurement
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Solution Overview
Problem
Conventional electric probes face limitations in measuring material properties due to their rigid structure, which restricts sample size and accessibility, especially when dealing with thin films, as they require large-scale connections that hinder close proximity to the sample.
Innovation Solution
A flexible electric probe with probe line conductors and connection conductors on opposite sides of a flexible substrate, connected via vias, allowing for offset patterns that enable small separations and flexible geometry, facilitating measurements on thin films without hindrance from electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a rigid substrate is used with electrical connections on the same side as the probe area, then structural stability is improved, but the probe cannot be placed arbitrarily close to the sample due to large-scale connections
Solution Approach 1:
The patent moves electrical connections from the same plane as the probe area to the opposite side of the substrate, utilizing the third dimension (depth/thickness) to resolve the spatial conflict. This allows the probe area to be positioned arbitrarily close to the sample while connections are routed through the substrate thickness to the other side, eliminating the need for large clearance around the probe area.
Solution Approach 2:
The patent divides the substrate into two functional sides: one side dedicated to the probe area for sample contact, and the opposite side for electrical connections. This segmentation allows each side to be optimized independently - the probe side for minimal sample clearance and the connection side for robust electrical interfacing.
2Ease of operation
If insulation is made thin to allow probe area contact with sample, then proximity to sample is improved, but electrical connection reliability deteriorates
Solution Approach 1:
By routing electrical connections through vias in the opposite side of the substrate, the patent eliminates the need for thin insulation over connections. The connections are positioned in a different spatial plane (opposite side), allowing thick insulation to be used for reliable electrical connections while the probe area on the other side maintains close proximity to the sample.
3Ease of operation
If large-scale connections are used for external apparatus, then ease of connection is improved, but the sample must be small enough to clear the connections
Solution Approach 1:
The patent relocates large-scale electrical connections to the opposite side of the substrate from the probe area. This spatial separation allows large connections to be made without restricting the sample size on the probe side, as the connections do not occupy the same physical space. The substrate acts as a barrier that isolates the two functional areas.
4Adaptability or versatility
If a flexible substrate is used with connections on the opposite side, then adaptability to different samples is improved, but manufacturing complexity increases
Solution Approach 1:
The patent divides the flexible substrate into two functional sides with distinct purposes: probe area side for sample interaction and connection side for electrical interfacing. This segmentation simplifies the design by allowing independent optimization of each side while using standard flexible substrate manufacturing processes.
Solution Approach 2:
The flexible substrate itself acts as an intermediary element that carries both the probe area and electrical connections. By using the substrate as the mediating structure with vias for connection routing, the patent avoids the need for separate rigid connection structures, thereby managing manufacturing complexity while achieving flexibility.
Data Source
AI summary
A flexible electric probe can include: a flexible substrate; and probe line conductors on the flexible substrate, the probe line conductors being essentially parallel to each other and having separations of about 5-50 microns. The flexible electric probe can further include connection conductors on the flexible substrate, the connection conductors and the probe line conductors electrically connected to each other, the probe line conductors positioned in first and second offset patterns with regard to the connection conductors.