Flexible Probe Substrates for Parallel LED Chip Electrical Testing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing methods for testing and screening wafer-level micro LED or mini LED chips are slow and inefficient, leading to increased production costs when multiple probe detection devices are used.
Innovation Solution
A chip electrical property detection device comprising a circuit control module, electrical detection module, and a flexible conductive structure, allowing movable carrying substrates to be adjusted through a flexible conductive material layer for precise electrical contact with LED chips.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple probe detection devices are used to increase testing speed, then productivity is improved, but device complexity and production cost increase
Solution Approach 1:
The probe detection device is segmented into multiple independent probe groups, where each probe group can independently test multiple LED chips simultaneously. This segmentation allows parallel testing operations without requiring multiple complete detection devices, thus improving productivity while controlling device complexity.
Solution Approach 2:
Multiple probe groups are merged into a single integrated detection device, sharing common control circuits and power supply systems. This merging approach enables simultaneous testing of multiple chips while avoiding the need for multiple separate devices, resolving the contradiction between productivity and device complexity.
2Productivity
If multiple probe detection devices are used to increase testing speed, then productivity is improved, but production cost increases
Solution Approach 1:
The device merges multiple probe groups into a single detection system, sharing expensive components such as control circuits, power supplies, and control substrates. This reduces the total production cost compared to deploying multiple separate detection devices, while still achieving high testing speed through parallel operation of probe groups.
Solution Approach 2:
The detection device is designed with universal components that serve multiple functions across different probe groups. The control circuit and power supply can simultaneously support multiple probe groups, reducing the total component count and production cost while maintaining high productivity.
3Stability of the object's composition
If rigid connection structures are used between modules, then structural stability is improved, but adaptability to chip position variations deteriorates
Solution Approach 1:
The patent introduces flexible connection structures including flexible printed circuit boards (FPC) and elastic pressing members that can bend and deform. These flexible components maintain stable electrical connections while adapting to position variations of LED chips, resolving the contradiction between structural stability and adaptability.
Solution Approach 2:
The connection structures are designed to be dynamic rather than rigid, allowing movement and deformation to accommodate chip position variations. The elastic pressing members can dynamically adjust their position and contact force, maintaining both structural stability and adaptability to different chip locations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances testing efficiency by enabling simultaneous electrical contact with multiple chips, reducing damage and production costs while maintaining uniform pressing force.
Implementation Method 1
The flexible conductive structure is electrically connected between the circuit control module and the electrical detection module
Implementation Method 2
The movable carrying substrates are separate from each other and disposed on the flexible conductive material layer
Data Source
AI summary
A chip electrical property detection device and a method of manufacturing the same are provided. The chip electrical property detection device includes a circuit control substrate, an electrical detection module and a flexible conductive structure. The circuit control module includes multiple electrical conduction structures. The electrical detection module includes multiple movable carrying substrates, multiple electrical detection structures and multiple electrical connection structures. The movable carrying substrates are separately arranged on the flexible conductive structure. The electrical detection structures are respectively disposed on the movable carrying substrates and electrically connected to the electrical connection structures. The electrical connection structures penetrate the movable carrying substrates and electrically connect to the electrical conduction structures through the flexible conductive structure, respectively. Each movable carrying substrate is allowed to be slightly adjusted through the flexible conductive structure, thereby allowing each electrical detection structure to be slightly adjusted following the corresponding movable carrying substrate.