Flexible Proximity Sensor with Force Imaging

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Existing proximity sensor devices for electronic systems are complex and costly due to the need for multiple substrates to detect both touch and force inputs, increasing manufacturing complexity and cost.

Innovation Solution

The solution involves arranging touch and force sensing electrodes on a single flexible substrate with a compliant component separating the substrate from a conductive layer, allowing the electrodes to move towards the conductive layer in response to applied force, enhancing capacitance detection and pressure sensitivity through additional features like a floating electrode layer and air gaps.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If touch and force electrodes are disposed on two or more substrates, then force sensing capability is achieved, but manufacturing cost and device complexity increase

Engineering Contradiction:
Improveforce sensing capabilityVSAvoiddevice complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The patent combines touch sensing electrodes and force sensing electrodes onto a single substrate, eliminating the need for multiple substrates. This merging approach maintains force sensing capability while reducing device complexity and manufacturing cost, directly resolving the technical contradiction between measurement precision and device complexity.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The single substrate is designed to perform multiple functions: it serves as both the support structure for touch sensing electrodes and force sensing electrodes, and as the common base layer for the entire sensor device. This multi-functionality reduces the number of components needed while maintaining full sensing capabilities.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Measurement precision

If touch and force electrodes are disposed on two or more substrates, then force sensing capability is achieved, but manufacturing cost increases

Engineering Contradiction:
Improveforce sensing capabilityVSAvoidmanufacturing cost
Core Design Contradiction:
Measurement precisionVSEase of manufacture

Solution Approach 1:

By merging touch and force electrodes onto a single substrate, the patent reduces the number of manufacturing steps, materials, and assembly operations required. This directly lowers manufacturing cost while preserving force sensing capability through the integrated electrode design.

Inventive Principle:
Principle #5Merging (Combining)

3Measurement precision

If electrodes move towards conductive layer in response to applied force, then pressure sensitivity is enhanced, but structural complexity increases

Engineering Contradiction:
Improvepressure sensitivityVSAvoidstructural complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The patent introduces a compliant layer between the substrate and conductive layer that allows dynamic deformation in response to applied force. This dynamic structural response enables the electrodes to move toward the conductive layer, enhancing pressure sensitivity through capacitance change while using a simple compliant layer rather than complex mechanical structures.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The compliant layer changes its physical state (deforms) in response to applied force, altering the distance between electrodes and the conductive layer. This parameter change (distance variation) directly modulates capacitance to enhance pressure sensitivity while maintaining structural simplicity through material compliance rather than mechanical complexity.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration reduces manufacturing complexity and cost while improving force sensing capabilities, enabling more sensitive and accurate user interface inputs with enhanced usability.

Implementation Method 1

In response to applied force, the touch and force electrodes move towards the conductive layer, changing the capacitance between the force electrodes and the conductive layer in a detectable way

Methodology Applied
Scientific EffectCapacitance: Capacitance

Implementation Method 2

a compliant component separating the substrate from a conductive layer. In response to applied force, the touch and force electrodes move towards the conductive layer

Methodology Applied
Scientific EffectElasticity: Elasticity

Implementation Method 3

Displaceable air gaps may also be disposed between the force pixels and the conductive substrate and configured to increase the electrical permittivity and, hence, the force response, of the force pixels responsive to applied pressure

Methodology Applied
Scientific EffectDielectric permittivity: Dielectric Permittivity

Data Source

PatentUS9841850B2Device and method for proximity sensing with force imaging
Publication Date: 2017.12.12 SYNAPTICS INC
  • US9841850B2 patent drawing
  • US9841850B2 patent drawing
  • US9841850B2 patent drawing

AI summary

Methods, systems and devices are described for operating an electronic system which includes a pliable component having an input surface, a first array of sensor electrodes, a second array of sensor electrodes, and a third array of sensor electrodes. The input device also includes a conductive substrate spaced apart from the pliable component and a compliant component disposed between the pliable component and the conductive substrate. In response to pressure applied by an input object to the input surface, the pliable component and the first, second, and third arrays of sensor electrodes locally deform and the compliant component locally compresses such that a spacing between the conductive substrate and at least one electrode from each of the first, second, and third arrays decreases.