Flexible PVDF Sensing Platform for Dynamic Strain and Vibration

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Solution Overview

Problem

Current rigid MEMS-based sensors are inadequate for measuring dynamic strain and high-frequency vibrations due to their limited frequency range and power consumption, and traditional piezo-electric sensors are bulky and stiff, making them unsuitable for non-invasive, flexible, and high-temperature applications.

Innovation Solution

A flexible computerized sensing apparatus using thin PVDF piezo-electric sensors with a flexible printed circuit substrate and surface-mounted electronics, allowing for non-invasive attachment to non-flat surfaces and capable of measuring dynamic strain and vibrations across a broad frequency range without the need for invasive mechanical processes.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If rigid MEMS-based sensors are used, then manufacturing precision is improved, but measurement precision for dynamic strain and high-frequency vibrations deteriorates

Engineering Contradiction:

Improvesensor fabrication accuracyVSAvoiddynamic strain and high-frequency vibration measurement accuracy

Core Design Contradiction:

Manufacturing precisionVSMeasurement precision

Solution Approach 1:

The patent changes the fundamental physical parameters of the sensor by transitioning from rigid MEMS structures to flexible piezoelectric materials (PVDF), enabling the sensor to respond to dynamic strain and high-frequency vibrations while maintaining manufacturing feasibility through flexible substrate integration

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The invention uses composite material structures combining flexible piezoelectric PVDF films with flexible printed circuit boards and encapsulation layers, creating a sensor that兼具 measurement precision for dynamic events and manufacturing robustness

Inventive Principle:

Principle #40Composite materials

2Measurement precision

If traditional piezo-electric sensors are used, then measurement precision for vibrations is improved, but device complexity and rigidity increase

Engineering Contradiction:

Improvevibration measurement accuracyVSAvoidsensor structure complexity and rigidity

Core Design Contradiction:

Measurement precisionVSDevice complexity

Solution Approach 1:

The patent employs thin flexible piezoelectric PVDF films instead of traditional rigid piezoelectric sensor housings, allowing the sensor to conform to complex surfaces and reducing overall device complexity while maintaining vibration measurement precision

Inventive Principle:

Principle #30Flexible shells and thin films

Solution Approach 2:

The invention replaces complex rigid mechanical mounting structures with flexible adhesive bonding and flexible printed circuit integration, eliminating the need for drilling, tapping, and threading operations

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Strength

If rigid sensing devices are attached with threaded fasteners, then mechanical coupling strength is improved, but ease of manufacture deteriorates due to invasive operations

Engineering Contradiction:

Improvemechanical coupling strengthVSAvoidinstallation simplicity and structure integrity

Core Design Contradiction:

StrengthVSEase of manufacture

Solution Approach 1:

The patent replaces mechanical fastening systems (threaded fasteners, drilling, tapping) with flexible adhesive bonding and flexible printed circuit board integration, enabling non-invasive attachment that preserves structure integrity while achieving sufficient mechanical coupling for dynamic strain measurement

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The flexible nature of the PVDF sensor film allows it to conform to and bond with surfaces without requiring invasive mechanical attachment, simplifying the manufacturing and installation process

Inventive Principle:

Principle #30Flexible shells and thin films

4Measurement precision

If rigid MEMS sensors are used for high-frequency measurement, then measurement precision is improved, but power consumption increases

Engineering Contradiction:

Improvehigh-frequency measurement capabilityVSAvoidpower consumption for high-frequency sensing

Core Design Contradiction:

Measurement precisionVSUse of energy by moving object

Solution Approach 1:

The patent changes the sensing mechanism from active rigid MEMS structures requiring significant power for high-frequency operation to passive flexible piezoelectric materials that generate electrical signals directly from mechanical deformation, dramatically reducing power consumption while maintaining high-frequency measurement precision

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables effective mechanical coupling and high-frequency vibration measurement while maintaining flexibility and avoiding the limitations of traditional sensors, such as power consumption and rigidity, with the ability to operate independently and withstand environmental factors.

Implementation Method 1

A flexible computerized sensing apparatus using thin PVDF piezo-electric sensors

Methodology Applied

Scientific EffectPiezo-electric effect: Piezoelectric Effect

Data Source

PatentUS20240032197A1Method of Manufacture and Use of a Flexible Computerized Sensing Device

Publication Date: 2024.01.25 BODNAR ERIC OLEG

AI summary

A thin, flexible computerized sensing platform which can be affixed to a structure to be sensed, which has excellent mechanical coupling between the sensors and the object to be sensed, which can be self-powered and rechargeable, and which can be environmentally sealed, and a method for assembling and utilizing the same.