Flexible Reinforcement Structure for Thinned Semiconductor Dies
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Solution Overview
Problem
Thinner semiconductor dies are prone to chipping, cracking, and failure due to thermomechanical stresses during manufacturing and subsequent processing, leading to yield loss and potential failures in semiconductor packages.
Innovation Solution
A flexible reinforcement structure is coupled to the second surface of thinned semiconductor dies, providing mechanical support and protection against chipping and cracking, while remaining attached during manufacturing and in the final device, allowing for the production of very thin semiconductor dies suitable for flexible electronics applications.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the semiconductor die is thinned to reduce overall package thickness, then the package size is reduced, but the die becomes more prone to chipping, cracking, and thermomechanical stress failure
Solution Approach 1:
A flexible reinforcement structure is coupled to the second surface of the thinned semiconductor die to provide mechanical support and protection. The reinforcement structure includes a flexible substrate with a thickness less than the semiconductor die thickness, allowing it to flex with the thin die while preventing chipping and cracking during handling and operation.
Solution Approach 2:
The reinforcement structure is formed using composite materials including a flexible substrate and an adhesive layer. The flexible substrate can be made of materials such as polyimide, polyester, or other flexible polymers that provide mechanical strength while maintaining flexibility to match the thin semiconductor die.
2Length of moving object
If the semiconductor die is thinned, then the overall device size is reduced, but the die becomes more susceptible to damage during subsequent processing steps
Solution Approach 1:
The flexible reinforcement structure is coupled to the thinned semiconductor die before subsequent processing steps to provide preliminary mechanical support. This prevents damage during handling, bonding, and other processing operations that would otherwise cause chipping or cracking of the thin die.
Solution Approach 2:
The flexible reinforcement structure acts as a protective thin film that maintains the mechanical strength of the thinned die while allowing the overall device to maintain a reduced thickness profile.
3Strength
If a rigid reinforcement structure is used to protect thin dies, then mechanical strength is improved, but flexibility and adaptability to thermomechanical stresses are reduced
Solution Approach 1:
The reinforcement structure uses a flexible substrate made of materials such as polyimide, polyester, or other flexible polymers that can bend and flex with the thin semiconductor die. This flexibility allows the reinforcement structure to adapt to thermomechanical stresses and chip-package interaction stresses without causing additional damage.
Solution Approach 2:
The reinforcement structure is designed with specific thickness parameters (less than the semiconductor die thickness) and material properties that balance mechanical strength and flexibility. The flexible substrate thickness and material selection are optimized to provide protection while maintaining adaptability to stress conditions.
Data Source
AI summary
Methods for manufacturing semiconductor devices having a flexible reinforcement structure, and associated systems and devices, are disclosed herein. In one embodiment, a method of manufacturing a semiconductor device includes electrically coupling at least one semiconductor die to a redistribution structure on a first carrier. The semiconductor die can include a first surface facing the redistribution structure and a second surface spaced apart from the redistribution structure. The method also includes reducing a thickness of the semiconductor die to no more than 10 μm. The method further includes coupling a flexible reinforcement structure to the second surface of the at least one semiconductor die.