Flexible Resin Substrate with Inorganic Layer for Thermal Stress Management
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Solution Overview
Problem
The development of organic light emitting devices using resin substrates is hindered by thermal stress-induced warping due to multilayer structures, which occurs when the resin substrate is peeled off from a support substrate.
Innovation Solution
A light emitting device with a flexible substrate comprising a first resin layer, a first inorganic layer positioned between the resin layers, and a second resin layer, where the first inorganic layer has a higher Young's modulus than the resin layers, helping to mitigate thermal stress and prevent warping.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a multilayer resin substrate structure is used, then the substrate provides good flexibility and formability, but thermal stress occurs causing warping when peeled from the support substrate
Solution Approach 1:
The patent applies composite materials by combining resin layers with an inorganic layer to create a multilayer substrate structure. The inorganic layer (silicon oxide, silicon nitride, or silicon oxynitride) is deposited between the resin layers to provide thermal stress compensation, preventing warping while maintaining the flexibility and formability of the resin substrate structure.
Solution Approach 2:
The patent changes the physical and chemical parameters of the substrate by introducing an inorganic layer with specific properties (high Young's modulus, low thermal expansion coefficient) between the resin layers. This parameter change enables the substrate to resist thermal stress-induced warping while preserving the desired flexibility for manufacturing processes.
2Adaptability or versatility
If the support substrate is removed after forming the light emitting portion, then the device achieves flexibility and portability, but warping occurs due to residual thermal stress
Solution Approach 1:
The patent applies preliminary action by forming the inorganic layer between the resin layers while the substrate is still on the support substrate, before the light emitting portion is formed and before the support is removed. This preliminary structural reinforcement ensures that when the support is later removed, the substrate has already been pre-conditioned to resist warping from residual thermal stress, maintaining both flexibility and reliability.
3Strength
If multiple resin layers are laminated to improve substrate properties, then the substrate achieves better mechanical characteristics, but thermal stress and warping increase
Solution Approach 1:
The patent introduces an inorganic layer as an intermediary between the resin layers. This intermediary layer acts as a stress buffer that compensates for thermal expansion differences between the resin layers, reducing thermal stress accumulation. The inorganic layer has intermediate properties between the resin layers, allowing it to mediate the thermal stress and prevent warping while the multilayer structure maintains its mechanical strength.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The inclusion of a high-modulus inorganic layer between resin layers effectively reduces thermal stress and warping, ensuring the substrate remains flat and functional even after removal from the support substrate.
Implementation Method 1
thermal stress may occur in the resin substrate due to the multilayer structure after the resin substrate is peeled off from the support substrate
Data Source
AI summary
A light emitting portion (200) is formed on a first surface of a substrate (100) (upper surface of the substrate (100) in an example illustrated in FIG. 1). A sealing member (300) seals the light emitting portion (200). In addition, the substrate (100) includes a first resin layer (110), a first inorganic layer (120), and a second resin layer (130). The first resin layer (110) is formed of a first resin material. The second resin layer (130) is formed of the first resin material, and is positioned closer to the first surface side of the substrate (100) than the first resin layer (110). The first inorganic layer (120) is positioned between the first resin layer (110) and the second resin layer (130).