Flexible Resin Substrate Touch Sensor Integration
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional display devices with touch sensors face challenges in integrating touch detection electrodes due to the peeling off of glass substrates during manufacturing, especially in flexible display devices where the touch detection electrode cannot be formed on the opposing substrate side, requiring additional FPC connections for both the display panel and touch detection circuits.
Innovation Solution
A semiconductor and display device structure featuring a first resin layer with a first wiring for touch detection, a second resin layer with a via hole and a transistor including a semiconductor layer, gate insulation, and gate electrode layer, where the second wiring connects to the transistor and first wiring through the via hole, allowing for a single FPC connection to both the display panel and touch detection drive circuit.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a glass substrate is used for the opposing substrate in a flexible display device, then the touch detection electrode can be formed on the opposing substrate side, but the glass substrate is peeled off during the manufacturing process
Solution Approach 1:
The patent replaces the glass substrate with a flexible resin substrate (opposing substrate made of flexible polymer material) that can withstand the manufacturing process without peeling, while still allowing formation of the touch detection electrode on its surface. This resolves the contradiction by providing both manufacturing stability and touch detection functionality.
2Reliability
If the touch detection electrode is formed on the opposing substrate side, then touch detection functionality is achieved, but an additional FPC is required for connecting the touch detection driving circuit
Solution Approach 1:
The patent combines the touch detection driving circuit with the display panel driving circuit on the same substrate side, allowing both circuits to be connected through a single FPC. This merging of functions reduces the number of FPC connections from two to one, resolving the contradiction between maintaining touch detection functionality and reducing device complexity.
Solution Approach 2:
The single FPC serves dual purposes by connecting both the display panel driving circuit and the touch detection driving circuit to the flexible substrate. This multi-functionality approach allows one FPC to replace what would traditionally require two separate FPCs, reducing overall device complexity while maintaining all necessary functionalities.
3Adaptability or versatility
If resin substrates are used for both the transistor array substrate and the opposing substrate in a flexible display device, then flexibility is achieved, but the opposing substrate must be peeled off during manufacturing
Solution Approach 1:
The patent specifies that the opposing substrate should be made of a flexible polymer material that maintains flexibility while being stable enough during the manufacturing process to prevent peeling. This resolves the contradiction by selecting materials that satisfy both flexibility requirements and manufacturing stability.
Data Source
AI summary
A semiconductor device includes a first resin layer, one or more first wirings above the first resin layer, a second resin layer above the first wiring, the second resin layer including a first opening part, a transistor above the second resin layer, the transistor including a semiconductor layer, a gate insulation layer, and a gate electrode layer; and a second wiring above the second resin layer, the second wiring being connected to the transistor and connected to the first wiring via the first opening part.