Flexible Resonant Circuit Element for EMI Noise Filtering
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing EMI filters with multilayer ceramic structures lack mechanical flexibility, limiting their geometric shape adaptability and mounting options in electronic devices.
Innovation Solution
A resonant circuit element comprising a flexible film with a conductive pattern and adhesive layer, allowing for shape alteration and mounting in varying locations, along with a pair of outer electrodes to function as an LC resonant circuit or choke coil, enabling efficient electric field generation and bonding to substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a multilayer ceramic structure is used for the EMI filter, then the filter provides effective noise filtering, but the structure lacks mechanical flexibility and limits geometric shape adaptability
Solution Approach 1:
The patent replaces rigid multilayer ceramic structures with flexible thin film structures. The EMI filter is constructed using flexible substrates with conductive patterns that can be bent and conform to various geometric shapes while maintaining noise filtering functionality. This allows the filter to adapt to different mounting locations with varying shapes.
Solution Approach 2:
The patent changes the physical state and material properties from rigid ceramic to flexible film materials. By altering the structural parameters from fixed multilayer geometry to flexible planar configurations, the filter maintains its electromagnetic interference suppression capability while gaining mechanical flexibility and geometric adaptability.
2Stability of the object's composition
If a rigid multilayer ceramic structure is used, then the filter maintains structural stability, but it cannot be mounted in locations of varying geometric shapes
Solution Approach 1:
The patent employs flexible thin film structures instead of rigid ceramic layers. These flexible films can be conformally mounted on surfaces with varying geometries while maintaining sufficient structural stability for EMI filtering operation. The flexibility allows adaptation to complex mounting locations.
Solution Approach 2:
The patent introduces dynamic adaptability by using flexible materials that can be deformed and conformated during mounting. The flexible structure allows the filter to adapt its shape dynamically to match the mounting location geometry, while the cured adhesive provides permanent structural stability once mounted.
3Adaptability or versatility
If the resonant circuit element uses a flexible film structure, then it can be mounted in various geometric shapes, but additional adhesive layers are required for secure bonding
Solution Approach 1:
The patent uses flexible film structures that inherently adapt to mounting surfaces, and combines this with adhesive layers for secure bonding. The adhesive layer acts as a bonding interface that maintains the flexibility benefit while providing the necessary mechanical attachment to various substrates.
Solution Approach 2:
The adhesive layer serves as an intermediary between the flexible resonant circuit element and the mounting substrate. It provides the bonding function that connects the flexible structure to rigid or curved surfaces, enabling secure mounting without compromising the flexibility and geometric adaptability of the resonant circuit element.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The flexible resonant circuit element can be easily mounted in various geometric shapes, providing effective noise filtering and secure bonding to substrates, while maintaining high current handling and adjustable inductance.
Implementation Method 1
a pair of first outer electrodes configured to generate an electric field in an in-plane direction of a composite member composed of the flexible film and the adhesive layer and to cause an electric current to flow through the first conductive pattern
Implementation Method 2
The first conductive pattern functions as an inductor
Implementation Method 3
the pair of outer electrodes and the composite member function as a capacitor
Implementation Method 4
The adhesive layer enables the resonant circuit element to be bonded to the mounting location
Data Source
AI summary
A first conductive pattern made from a conductive material is formed on a first surface that is one surface of a flexible film made from a dielectric material. An adhesive layer is disposed on a second surface opposite to the first surface of the flexible film. A pair of first outer electrodes generates an electric field in an in-plane direction of a composite member composed of the flexible film and the adhesive layer, and causes an electric current to flow through the first conductive pattern.