Flexible Resonant Sensor Structure for Deformation and Short-Circuit Isolation
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Solution Overview
Problem
Existing resonant sensors made with rigid packaging materials are unable to withstand large deformations, limiting their performance in flexible electronic systems or environments with flexible features.
Innovation Solution
A resonant sensor design featuring a sensor body with flexible substrates, including a support component and sensitive elements connected via conductor parts on a third substrate, allowing the sensor to operate in flexible environments while preventing short circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If rigid packaging technology is used to protect the sensitive element, then the sensor housing and substrate provide strong physical protection, but the resonant sensor cannot withstand large deformation and cannot operate in flexible environments
Solution Approach 1:
The patent replaces rigid packaging materials with flexible substrates including a first flexible substrate, second flexible substrate, and third flexible substrate. These flexible substrates form the sensor housing and protective layers, enabling the resonant sensor to withstand large deformations while maintaining physical protection of the sensitive element. The flexible substrates allow the sensor to operate in flexible electronic systems and environments with flexible feature requirements.
Solution Approach 2:
The patent employs composite material structures combining multiple flexible substrate layers with different functions. The first flexible substrate provides housing structure, the second flexible substrate provides electrical connection, and the third flexible substrate provides additional protection and connection. This composite approach maintains both protection capability and flexibility adaptability.
2Strength
If the first substrate is disposed close to the sensitive element for protection, then physical protection is improved, but the first substrate may contact and damage the sensitive element
Solution Approach 1:
The patent introduces a support component as an intermediary element disposed between the first flexible substrate and the sensitive element. The support component includes a first hollow part that isolates the first flexible substrate from the sensitive element, preventing direct contact that could cause damage. This intermediary structure maintains the protective function of the first substrate while ensuring the reliability and stability of the sensitive element.
3Reliability
If conductor parts are placed on the third substrate for electrical connection, then electrical connectivity is improved, but short circuit between conductor parts may occur
Solution Approach 1:
The patent segments the third flexible substrate by creating a first hollow part that divides and isolates the first conductor part from the second conductor part. This segmentation prevents direct contact between the conductor parts, eliminating the short circuit risk while maintaining reliable electrical connections through the isolated conductor paths on the third flexible substrate.
Data Source
AI summary
This application provides a resonant sensor, a battery, a battery pack, and an energy storage system. The resonant sensor includes the first substrate, the second substrate, and the third substrate which are all flexible substrates, the resonant sensor may operate in an environment with a flexible feature requirement.