Flexible Retention Ring for Liquid Thermal Interface Material
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Solution Overview
Problem
The application of liquid thermal interface material (LTIM) in electronic devices faces issues such as smearing, excess, or shortage due to improper dispensing and handling problems during the assembly of solid-state drive (SSD) products, leading to inadequate thermal dissipation and potential overheating.
Innovation Solution
A flexible retention ring, made of compressible or collapsible materials like concentric cylinders or spring coils, is placed on top of electronic components to contain LTIM, adjusting to the gap between the component and the SSD enclosure, ensuring proper thermal contact and minimizing application issues.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If liquid thermal interface material (LTIM) is dispensed during assembly, then thermal coupling is achieved, but smearing, excess, or shortage occurs leading to inadequate thermal dissipation
Solution Approach 1:
The reservoir structure is pre-formed on the component surface before LTIM dispensing, creating a defined containment area that guides proper LTIM placement and prevents smearing and excess application during the thermal interface process
Solution Approach 2:
The reservoir structure provides localized containment for LTIM at the specific interface area between component and heat sink, ensuring precise thermal coupling only where needed while preventing unwanted LTIM migration to surrounding areas
2Temperature
If LTIM is applied to ensure thermal contact, then heat dissipation is improved, but handling problems during assembly occur
Solution Approach 1:
The reservoir structure is pre-formed and attached to the component before LTIM application, establishing a containment boundary that simplifies the LTIM dispensing process and prevents handling issues during assembly operations
Solution Approach 2:
The reservoir structure acts as an intermediary containment element between the LTIM and the assembly process, protecting the thermal interface material from premature contact with surrounding surfaces and simplifying handling during assembly
3Reliability
If a rigid retention structure is used to contain LTIM, then LTIM retention is improved, but adaptability to gap variations is reduced
Solution Approach 1:
The reservoir structure incorporates flexible or collapsible walls that can dynamically adjust to varying gaps between components and heat sinks, maintaining LTIM containment while adapting to different assembly tolerances and component variations
Solution Approach 2:
The reservoir structure's physical parameters (such as wall flexibility or collapsibility) enable it to change its containment volume and shape in response to gap variations, ensuring reliable LTIM retention across different assembly conditions
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The flexible retention ring effectively retains LTIM, reducing smearing and excess, ensuring robust thermal contact and efficient heat dissipation, thus preventing overheating in SSDs despite application and handling challenges.
Implementation Method 1
A flexible retention ring, made of compressible or collapsible materials like concentric cylinders or spring coils, is placed on top of electronic components to contain LTIM, adjusting to the gap between the component and the SSD enclosure
Implementation Method 2
A flexible retention ring, made of compressible or collapsible materials like concentric cylinders or spring coils, is placed on top of electronic components to contain LTIM
Implementation Method 3
Thermal interface material (TIM) refers to a material which may be positioned between two devices to facilitate a thermal coupling between the two devices
Data Source
AI summary
An embodiment of an electronic apparatus may include an electronic device package having a first surface, a heat conductive structure having a second surface, a reservoir structure positioned between the first surface of the electronic device package and the second surface of the heat conductive structure, and a thermal interface material disposed within the reservoir structure between the first surface of the electronic device package and the second surface of the heat conductive structure to place the first surface in thermal communication with the second surface. Other embodiments are disclosed and claimed.


