Flexible Retention Ring for Liquid Thermal Interface Material

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Solution Overview

Problem

The application of liquid thermal interface material (LTIM) in electronic devices faces issues such as smearing, excess, or shortage due to improper dispensing and handling problems during the assembly of solid-state drive (SSD) products, leading to inadequate thermal dissipation and potential overheating.

Innovation Solution

A flexible retention ring, made of compressible or collapsible materials like concentric cylinders or spring coils, is placed on top of electronic components to contain LTIM, adjusting to the gap between the component and the SSD enclosure, ensuring proper thermal contact and minimizing application issues.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If liquid thermal interface material (LTIM) is dispensed during assembly, then thermal coupling is achieved, but smearing, excess, or shortage occurs leading to inadequate thermal dissipation

Engineering Contradiction:
Improvethermal dissipation reliabilityVSAvoidLTIM application precision
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The reservoir structure is pre-formed on the component surface before LTIM dispensing, creating a defined containment area that guides proper LTIM placement and prevents smearing and excess application during the thermal interface process

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The reservoir structure provides localized containment for LTIM at the specific interface area between component and heat sink, ensuring precise thermal coupling only where needed while preventing unwanted LTIM migration to surrounding areas

Inventive Principle:
Principle #3Local quality

2Temperature

If LTIM is applied to ensure thermal contact, then heat dissipation is improved, but handling problems during assembly occur

Engineering Contradiction:
Improveheat dissipation efficiencyVSAvoidassembly handling ease
Core Design Contradiction:
TemperatureVSEase of operation

Solution Approach 1:

The reservoir structure is pre-formed and attached to the component before LTIM application, establishing a containment boundary that simplifies the LTIM dispensing process and prevents handling issues during assembly operations

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The reservoir structure acts as an intermediary containment element between the LTIM and the assembly process, protecting the thermal interface material from premature contact with surrounding surfaces and simplifying handling during assembly

Inventive Principle:
Principle #24Intermediary (Mediator)

3Reliability

If a rigid retention structure is used to contain LTIM, then LTIM retention is improved, but adaptability to gap variations is reduced

Engineering Contradiction:
ImproveLTIM retention reliabilityVSAvoidgap adjustment adaptability
Core Design Contradiction:
ReliabilityVSAdaptability or versatility

Solution Approach 1:

The reservoir structure incorporates flexible or collapsible walls that can dynamically adjust to varying gaps between components and heat sinks, maintaining LTIM containment while adapting to different assembly tolerances and component variations

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The reservoir structure's physical parameters (such as wall flexibility or collapsibility) enable it to change its containment volume and shape in response to gap variations, ensuring reliable LTIM retention across different assembly conditions

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The flexible retention ring effectively retains LTIM, reducing smearing and excess, ensuring robust thermal contact and efficient heat dissipation, thus preventing overheating in SSDs despite application and handling challenges.

Implementation Method 1

A flexible retention ring, made of compressible or collapsible materials like concentric cylinders or spring coils, is placed on top of electronic components to contain LTIM, adjusting to the gap between the component and the SSD enclosure

Methodology Applied
Scientific EffectElasticity: Elasticity

Implementation Method 2

A flexible retention ring, made of compressible or collapsible materials like concentric cylinders or spring coils, is placed on top of electronic components to contain LTIM

Methodology Applied
Scientific EffectPhysical containment: Physical Containment

Implementation Method 3

Thermal interface material (TIM) refers to a material which may be positioned between two devices to facilitate a thermal coupling between the two devices

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS11844197B2Flexible retention ring for thermal interface material
Publication Date: 2023.12.12 INTEL CORP
  • US11844197B2 patent drawing
  • US11844197B2 patent drawing
  • US11844197B2 patent drawing

AI summary

An embodiment of an electronic apparatus may include an electronic device package having a first surface, a heat conductive structure having a second surface, a reservoir structure positioned between the first surface of the electronic device package and the second surface of the heat conductive structure, and a thermal interface material disposed within the reservoir structure between the first surface of the electronic device package and the second surface of the heat conductive structure to place the first surface in thermal communication with the second surface. Other embodiments are disclosed and claimed.