Flexible RFID Antenna Single-Sided Helical Coil Design
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Solution Overview
Problem
Conventional RFID antenna manufacturing processes are inefficient, leading to high material wastage and increased costs due to the need for double-sided substrates and complex production methods, which complicates the integration of RFID technology into portable devices like POS systems.
Innovation Solution
A flexible single-sided RFID antenna design featuring a substrate with conductors printed on one side, a covering layer, and a helical coil structure formed by staggered conductor connections, eliminating the need for through holes and simplifying the production process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a double-sided substrate is used to connect inner periphery to outer periphery through holes, then the antenna can be manufactured with conventional methods, but the production process becomes more complex and material utilization decreases
Solution Approach 1:
The antenna substrate is divided into multiple sections with conductors arranged in specific patterns (first conductors, second conductors, third conductors) that can be independently manufactured and then assembled. This segmentation allows single-sided manufacturing while achieving the connectivity function of double-sided substrates through modular assembly of antenna sections.
Solution Approach 2:
The patent transitions from a planar double-sided substrate approach to a three-dimensional assembled structure. Multiple single-sided substrate sections are stacked and connected in the vertical dimension, eliminating the need for through-holes while achieving electrical connectivity between inner and outer peripheries through the stacked configuration.
2Reliability
If through holes are arranged on the substrate to connect inner periphery to outer periphery, then conductor connectivity is achieved, but the production process is complicated and costs increase
Solution Approach 1:
The antenna is divided into multiple sections that are manufactured separately on single-sided substrates and then assembled. This segmentation eliminates the need for through-holes in each substrate while maintaining conductor connectivity through the assembled structure, simplifying the production process for each individual substrate.
Solution Approach 2:
The patent introduces intermediate connection structures (such as connection terminals and bonding pads) that facilitate electrical connectivity between substrate sections without requiring through-holes. These intermediaries enable reliable conductor connectivity while avoiding the complexity of drilling and plating through-holes in flexible substrates.
3Reliability
If conventional double-sided substrate methods are used, then antenna functionality is achieved, but the cost of the POS device increases
Solution Approach 1:
Instead of using a double-sided substrate approach that requires expensive through-hole processing, the patent inverts the approach by using multiple single-sided substrates assembled together. This inversion achieves the same connectivity function while using simpler, more cost-effective single-sided manufacturing processes.
Solution Approach 2:
The patent changes the manufacturing parameters from double-sided substrate processing to single-sided substrate processing with assembly. This parameter change includes using standard single-sided flexible substrates, eliminating through-hole drilling and plating operations, and using simpler connection methods that reduce overall production costs while maintaining antenna functionality.
Data Source
AI summary
An RFID antenna has a flexible single-sided substrate including a first end, a second end and a leading-out terminal. A plurality of parallel conductors are provided on the substrate and extend between the first end and the second end of the substrate. One of the multiple conductors is broken at the leading-out terminal and extends to an end of the leading-out terminal to form a connection terminal. A flexible covering layer is attached to the substrate and covers the conductors. Ends of the conductors on the first end of the substrate are respectively connected to ends of the conductors on the second end of the substrate to form a helical RFID coil.