Flexible RFID Inlay Bonding for Dense Circuits and Precise Alignment
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Solution Overview
Problem
Existing methods for manufacturing RFID inlays face challenges in achieving high-density RFID drive circuit formation due to large antenna sizes, leading to low production efficiency and increased costs, and the use of hard IC chip wafers that are prone to damage under bending or pressure, causing RFID tag malfunction.
Innovation Solution
A method involving the bonding of a first film substrate with an RFID circuit and a second film substrate with an antenna, where the circuit includes a transistor formed by a conductive pattern, an insulating layer, and an organic semiconductor or carbon material semiconductor layer, allowing for flexible wireless communication devices with high position accuracy and reduced area, and enabling bonding without wires or conductive tapes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of moving object
If RFID drive circuits and antennas are formed on the same substrate, then the antenna size becomes large, but the RFID drive circuit cannot be formed at high density
Solution Approach 1:
The invention divides the RFID system into separate components: RFID drive circuits are formed on a first substrate while antennas are formed on a second substrate. This segmentation allows each component to be optimized independently and enables high-density circuit formation without being constrained by antenna space requirements.
Solution Approach 2:
The invention transitions from a planar two-dimensional layout to a three-dimensional stacked configuration by bonding the first substrate containing the RFID drive circuit with the second substrate containing the antenna. This vertical arrangement allows both components to coexist in a compact space while maintaining high circuit density.
2Strength
If hard IC chip wafers are used for RFID inlays, then the device structure is rigid, but the base material is damaged under bending or pressure
Solution Approach 1:
The invention replaces rigid IC chip wafers with flexible film substrates for forming RFID drive circuits. This allows the entire RFID inlay structure to flex without causing base material damage or tag malfunction, while maintaining electrical connectivity and functionality under bending and pressure conditions.
Solution Approach 2:
The invention changes the mechanical properties of the substrate from rigid (hard IC chip wafer) to flexible (film substrate). This parameter change in material rigidity allows the device to withstand bending and pressure without damage, improving reliability in flexible applications.
3Productivity
If separate substrates are used for RFID drive circuits and antennas, then high-density circuit formation is achieved, but bonding position accuracy becomes critical
Solution Approach 1:
The invention incorporates alignment marks on both the first substrate and second substrate before bonding. These pre-formed alignment features enable precise positioning and accurate bonding of the two substrates, ensuring proper alignment between RFID drive circuits and antennas even when formed on separate substrates.
Data Source
AI summary
A flexible wireless communication device with high position accuracy and low cost by a simple process is described, including a wireless communication device and a method for manufacturing a wireless communication device formed by bonding a first film substrate on which at least a circuit is formed and a second film substrate on which an antenna is formed, in which the circuit includes a transistor, and the transistor is formed by a step of forming a conductive pattern on the first film substrate, a step of forming an insulating layer on the film substrate on which the conductive pattern is formed, and a step of applying a solution including an organic semiconductor and/or a carbon material on the insulating layer and drying the solution to form a semiconductor layer.