Flexible RFID Sensor with Conductive Adhesive Bonding

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Solution Overview

Problem

Conventional RFID devices with integrated power supply and sensors face challenges in reducing thickness and cost due to the need for high-temperature resistant materials during the reflow process, leading to increased bulk volume and weight.

Innovation Solution

A RFID sensing and recording device with a flexible substrate and antenna module electrically bonded using conductive adhesives and pressing, eliminating the reflow process, and integrating a battery module for power supply, allowing for a thinner and lighter design while simplifying the manufacturing process.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the substrate module and antenna module are electrically bonded through a reflow process, then reliable electrical connection is achieved, but high-temperature resistant materials are required which increase the cost, bulk volume and thickness

Engineering Contradiction:

Improveelectrical connection reliabilityVSAvoiddevice thickness

Core Design Contradiction:

ReliabilityVSVolume of moving object

Solution Approach 1:

The patent changes the bonding temperature parameter from high-temperature reflow process to low-temperature conductive adhesive bonding. This allows the use of flexible substrates with lower temperature resistance requirements, thereby reducing device thickness and cost while maintaining electrical connection reliability through the conductive adhesive material

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent introduces conductive adhesive as an intermediary material between the substrate module and antenna module. This intermediary enables electrical bonding at lower temperatures, eliminating the need for high-temperature resistant materials and reducing overall device thickness while ensuring reliable electrical connection

Inventive Principle:

Principle #24Intermediary (Mediator)

2Reliability

If high-temperature resistant materials are used for the substrate, then heat damage during reflow process is prevented, but manufacturing cost and device thickness increase

Engineering Contradiction:

Improveheat resistance during manufacturingVSAvoidmanufacturing cost

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The patent replaces expensive high-temperature resistant substrates with cheaper flexible substrates that cannot withstand reflow temperatures. By using conductive adhesive bonding instead of reflow soldering, the system enables the use of cost-effective flexible materials while achieving the same manufacturing goal through an alternative process

Inventive Principle:

Principle #27Cheap short-living objects (Disposable)

3Adaptability or versatility

If multiple components (RFID tag, sensor, power supply) are integrated, then sensing and recording capabilities are enhanced, but device thickness increases

Engineering Contradiction:

Improvesensing and recording capabilityVSAvoiddevice thickness

Core Design Contradiction:

Adaptability or versatilityVSVolume of moving object

Solution Approach 1:

The patent merges the RFID tag, sensor, and power supply components onto a single flexible substrate module. This consolidation integrates multiple functions into one thin layer, enhancing versatility while maintaining minimal device thickness that would be impossible with conventional rigid multi-component assemblies

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent uses a flexible substrate as the base for integrating multiple components. This flexible film approach allows thin-film fabrication techniques to be used, enabling high-density integration of RFID tags, sensors, and power supplies in a ultra-thin configuration that reduces overall device thickness

Inventive Principle:

Principle #30Flexible shells and thin films

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution reduces manufacturing costs and device weight, enabling thinner and lighter RFID devices with enhanced sensing and recording capabilities, applicable in various fields like IoT, smart living, and medical care.

Implementation Method 1

a flexible antenna module is electrically bonded with a RFID sensing module having RFID chip and passive elements through adhesives and pressing procedure

Methodology Applied

Scientific EffectElectrical conduction: Conduction (electrical)

Data Source

PatentUS10242308B2RFID sensing and recording device and method for making the same

Publication Date: 2019.03.26 SECURITAG ASSEMBLY GROUP

AI summary

The present invention provides a radio frequency identification and sensing device comprising an antenna module, a RFID sensing module, and battery module. The antenna module has a first flexible substrate having an antenna circuit formed thereon. The RFID sensing module comprises a second flexible substrate, a RFID chip, a sensor formed on the second flexible substrate and a memory module formed on the second flexible substrate, wherein the sensor is utilized to detecting an environmental status for generating a plurality of sensing data, and the memory module is utilized to store the plurality of sensing data. The RFID chip is utilized to transfer the plurality of data to a reading device. The battery module is utilized to provide electrical power for operating the RFID sensing module.