Flexible RFID Tag Packaging for Mechanical Stress Protection
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Solution Overview
Problem
Existing electronic devices, such as RFID tags, mounted on structures like pipes and girders, are prone to damage due to mechanical stress, as they lack adequate protection against impact and curvature variations, leading to costly damage and inoperability.
Innovation Solution
A flexible packaging system using interlocking mushroom-stem dual lock materials and a combination of hard caps with gel provides protection by absorbing impact and accommodating different surface curvatures, ensuring the electronic devices remain functional under mechanical stress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If hard surfaced packages are used to protect electronic devices, then protection from mechanical stress is improved, but the package can be crushed or sheared off when subjected to impact loads
Solution Approach 1:
The patent applies flexible protective packaging material that can deform under impact loads rather than rigid hard surfaces. This flexible material absorbs and distributes impact forces, preventing the package from being crushed or sheared off while maintaining protection for the electronic device during harsh handling and shipping.
2Adaptability or versatility
If different hard surfaced packages are used for different curvatures, then adaptability to different surfaces is improved, but device complexity and cost increase
Solution Approach 1:
The patent employs a universal flexible protective packaging design that can accommodate various surface curvatures without requiring different package types. The flexible material conforms to different shapes and curvatures, providing adequate protection across multiple applications while maintaining a single standardized package design, thereby reducing complexity and cost.
3Device complexity
If no protection is provided, then device complexity is reduced, but electronic devices are damaged and rendered inoperable
Solution Approach 1:
The patent implements a simple yet effective flexible protective layer that provides necessary mechanical protection without adding complex structural elements. This flexible packaging maintains device reliability during handling and shipping while keeping the overall design simple and cost-effective.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The packaging system effectively reduces damage from mechanical stress, allowing electronic devices to survive harsh handling and mounting on variously curved surfaces without compromising functionality.
Implementation Method 1
A flexible packaging system using interlocking mushroom-stem dual lock materials and a combination of hard caps with gel provides protection by absorbing impact
Implementation Method 2
A flexible packaging system using interlocking mushroom-stem dual lock materials
Data Source
AI summary
An electronic packaging system includes an electronic device. The electronic packaging system also includes a flexible material located adjacent a plurality of sides of the electronic device. The electronic device is located in a cavity in the flexible material. The flexible material has a first height and a first width. The electronic device has a second height. The first height is greater than the second height and the first width is greater than the first height so the flexible material protects the electronic device from loading.