Flexible-Rigid PCB Antenna Thermal Management via Segmented Groove
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Solution Overview
Problem
The integration of radio frequency integrated circuit structures and antenna modules into circuit boards for 5th generation wireless systems leads to increased heat dissipation challenges, as existing technologies struggle to effectively manage heat buildup.
Innovation Solution
A method for manufacturing an antenna printed circuit board involves a flexible-rigid printed circuit board design with a rigid region and a flexible region connected by stiffening plates, where antenna and RF integrated circuit structures are attached using conductive paste and fixed through reflow soldering, allowing for independent arrangement and improved heat dissipation with dielectric material filling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If radio frequency integrated circuit structures and antenna modules are integrated into the circuit board, then the functionality and performance of the wireless system are improved, but heat dissipation becomes difficult and heat buildup increases
Solution Approach 1:
The circuit board is divided into a rigid region and a flexible region, with the flexible region containing a groove that exposes connecting pads. This segmentation allows separate attachment of RF integrated circuit structures and antenna modules to different regions, improving heat dissipation by distributing heat sources and enabling independent thermal management of each component.
Solution Approach 2:
The patent utilizes the third dimension by creating a groove structure on the flexible region of the circuit board. The groove exposes connecting pads and creates a recessed area for component attachment, adding vertical dimensionality to the heat dissipation pathway and allowing better thermal management through increased surface area and air circulation.
2Volume of moving object
If antenna and RF modules are integrated onto the circuit board, then the system compactness is improved, but the service life and reliability are reduced due to difficulty in identifying and replacing failed components
Solution Approach 1:
The circuit board structure segments the attachment regions into distinct rigid and flexible areas with exposed connecting pads. This segmentation enables independent identification and replacement of failed components (antenna module or RF integrated circuit structure) without affecting the other, thereby extending service life while maintaining compact integration.
Solution Approach 2:
The flexible region with groove structure acts as an intermediary that facilitates both compact integration and easy replacement. The groove exposes connecting pads and provides a structured interface that allows components to be attached securely yet replaced independently, mediating between the conflicting requirements of compactness and maintainability.
3Ease of manufacture
If traditional circuit board design is used, then manufacturing simplicity is maintained, but heat dissipation capability and component replaceability are insufficient
Solution Approach 1:
The flexible region is segmented with a groove structure that exposes connecting pads, creating distinct attachment zones. This segmentation can be implemented using standard PCB fabrication processes, maintaining manufacturing simplicity while significantly improving heat dissipation capability through increased surface area and air circulation around components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances heat dissipation and extends the service life of the antenna printed circuit board by facilitating separate attachment and arrangement of antenna and RF modules, enabling easier identification and replacement of failed components.
Implementation Method 1
a reflow soldering process is performed to fix the antenna module and the radio frequency integrated circuit structure on the rigid region
Data Source
AI summary
A method for manufacturing an antenna printed circuit board includes the following steps: providing a flexible-rigid printed circuit board comprising a flexible region and a rigid region. The flexible region comprises at least one first connecting pad and at least one second connecting pad arranged opposite sides of the rigid region. At least one antenna module is attached to the first connecting pad through a conductive paste. The antenna module is fixed on the rigid region by a first reflow soldering process. At least one radio frequency integrated circuit structure is attached to the second connecting pad through a conductive paste. The radio frequency integrated circuit is fixed on the rigid region by a second reflow soldering process. A gap between the antenna module and the rigid region and a gap between the radio frequency integrated circuit structure and the rigid region are filled with dielectric materials and cured.