Flexible Screen Bonding Structure for Chip Peeling Stress Relief
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Solution Overview
Problem
The low peeling-off yield of flexible screens during the manufacturing process due to stress concentration and damage to circuits around the chip during peeling-off.
Innovation Solution
A bonding structure for flexible screens featuring a flexible protective layer with different hardness levels around the chip, comprising a first protective layer (e.g., UV adhesive) and a second protective layer (e.g., silica gel) with varying thicknesses, forming a stress gradient to disperse stress and avoid concentration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the flexible screen is bonded to a substrate with a chip in the bonding area, then the bonding process can be performed, but stress concentration occurs at the chip position during peeling-off causing circuit damage
Solution Approach 1:
The patent applies local quality by creating a stress gradient through varying the thickness of the flexible protective layer at different locations. The thickness is specifically increased in the direction from the bonding area toward the display area, making different parts of the protective layer have different mechanical properties. This local variation in thickness distributes the stress during peeling-off, preventing stress concentration at the chip position while maintaining bonding reliability.
2Stress or pressure
If a flexible protective layer is added around the chip, then stress distribution is improved, but the device complexity increases
Solution Approach 1:
The patent employs composite materials by combining the flexible protective layer with different stiffness characteristics in different regions. The protective layer integrates with the substrate and chip structure to form a composite system where the flexible portion provides stress distribution while maintaining overall structural integrity. This composite approach achieves stress distribution without requiring completely separate protective components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The stress gradient formed by the flexible protective layer effectively disperses stress around the chip, reducing the risk of circuit damage and increasing the peeling-off yield of flexible screens.
Implementation Method 1
A bonding structure for flexible screens featuring a flexible protective layer with different hardness levels around the chip, comprising a first protective layer (e.g., UV adhesive) and a second protective layer (e.g., silica gel) with varying thicknesses, forming a stress gradient to disperse stress and avoid concentration.
Data Source
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AI summary
A bonding structure for a flexible screen and a manufacturing method of the same are provided. A flexible screen and a chip (20) mounted on a surface of the flexible screen are arranged on the bonding structure for the flexible screen, and a bonding area (11) for bonding the chip is arranged on the flexible screen, and a flexible protective layer (30) is coated in the bonding area (11), and the flexible protective layer (30) surrounds around the chip (20). Compared with the prior art, by forming the flexible protective layer (30) with different hardness around the chip (20), the stress generated around the chip (20) during the peeling-off are greatly dispersed, a stress gradient is formed, the stress concentration at the position closely adjacent to the periphery of the chip (20) is avoided, the risk of the circuits around the chip (20) being pulled broken can be reduced, and the peeling-off yield of the flexible screen can be finally increased.