Flexible Semiconductor Device Transfer via Amphipathic Interface

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Solution Overview

Problem

Manufacturing nitride semiconductor-based light-emitting devices on non-flexible substrates results in rigid devices, making it difficult to transform and increasing costs, especially for large surface area devices.

Innovation Solution

A method of transferring semiconductor elements from non-flexible substrates to flexible substrates involves forming vertical semiconductor elements, coating with an inorganic insulating layer, introducing -OH groups, forming an amphipathic layer, and embedding them in a polymerizable composition to create a resin layer that can be separated from the substrate, allowing for the formation of flexible semiconductor devices with embedded electrodes.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If semiconductor elements are manufactured on non-flexible substrates, then manufacturing precision and device reliability are improved, but device flexibility and ease of transformation deteriorate

Engineering Contradiction:

Improvedevice reliabilityVSAvoiddevice flexibility

Core Design Contradiction:

ReliabilityVSAdaptability or versatility

Solution Approach 1:

The invention segments the device into three distinct parts: the rigid substrate where semiconductor elements are manufactured with high precision, the flexible resin layer that provides adaptability, and the interface layer that enables separation. This segmentation allows each part to fulfill its specific function without compromise

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The invention introduces an intermediary flexible resin layer between the rigid substrate and the final device application. This intermediary layer acts as a mediator that transfers the semiconductor elements from the rigid substrate while providing the desired flexibility and adaptability in the final device configuration

Inventive Principle:

Principle #24Intermediary (Mediator)

2Manufacturing precision

If non-flexible substrates are used for manufacturing, then manufacturing precision is improved, but ease of manufacture for large surface area devices deteriorates

Engineering Contradiction:

Improveepitaxial growth precisionVSAvoidease of manufacture

Core Design Contradiction:

Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The manufacturing process is segmented into two independent stages: precise epitaxial growth on rigid substrates in controlled environments, and subsequent transfer to flexible resin layers. This segmentation allows high-precision manufacturing to be decoupled from large-area flexibility requirements

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The invention extracts the semiconductor elements from their original rigid substrate context and transfers them to a flexible resin layer. This extraction allows the precise manufactured elements to be reconfigured for large-area flexible applications without being constrained by the original substrate

Inventive Principle:

Principle #2Taking out (Extraction)

3Adaptability or versatility

If semiconductor elements are transferred to flexible substrates, then device flexibility and ease of manufacture are improved, but bonding strength between elements and substrate may deteriorate

Engineering Contradiction:

Improvedevice flexibilityVSAvoidbonding strength

Core Design Contradiction:

Adaptability or versatilityVSStrength

Solution Approach 1:

The invention introduces an interface layer as an intermediary between the semiconductor elements and the flexible resin layer. This interface layer ensures strong and reliable bonding while allowing the overall device to maintain flexibility, thus resolving the contradiction between bonding strength and device flexibility

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method enables the effective transfer of semiconductor elements to flexible substrates, enhancing device flexibility and reducing manufacturing costs by allowing for larger surface area production while maintaining strong bonding between the semiconductor elements and the resin layer.

Implementation Method 1

The amphipathic layer and the inorganic insulating layer are bonded to each other through a hydrolytic condensation reaction

Methodology Applied

Scientific EffectHydrolytic condensation reaction: Hydrolysis

Implementation Method 2

coating a polymerizable composition on the vertical semiconductor elements coated with the amphipathic layer; curing the polymerizable composition to form a first resin layer with the vertical semiconductor elements embedded therein

Methodology Applied

Scientific EffectCuring: Photopolymerisation

Data Source

PatentEP2772948B1Method of transferring semiconductor elements and of manufacturing flexible semiconductor devices

Publication Date: 2018.04.11 SAMSUNG ELECTRONICS CO LTD

Figure 1A~1C
Figure 1D~1F
Figure 2~4

AI summary

The present disclosure relates to a method of transferring semiconductor elements (200) from a non-flexible substrate (100) to a flexible substrate (450). The present disclosure also relates to a method of manufacturing a flexible semiconductor device based on the method of transferring semiconductor elements. The semiconductor elements (200) grown or formed on a non-flexible substrate (100) may be effectively transferred to a resin layer (450) while maintaining an arrangement of the semiconductor elements. The resin layer may function as a flexible substrate for supporting the vertical semiconductor elements (200).