Flexible Semiconductor Chip Warpage Suppression via Pressing Member
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Solution Overview
Problem
The warpage of semiconductor chips during the soldering process leads to voids in the solder between the chip and the heat radiation material, impairing heat radiation performance due to the melting of solder on the lower surface of the chip.
Innovation Solution
A semiconductor device design that includes a flexible semiconductor chip bonded to a heat radiation material with solder and a pressing member with a protrusion that presses the chip from the upper side to prevent warpage and voids, enhancing heat radiation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the semiconductor chip area is increased to improve heat radiation performance, then the heat radiation capability is improved, but the chip becomes deformed and warped
Solution Approach 1:
The pressing member applies pressure to the semiconductor chip in advance during the soldering process to prevent convex warpage before it occurs. This preliminary counter-action ensures the chip remains flat during heating, avoiding the formation of voids in the solder and maintaining effective heat radiation contact between the chip and heat radiation material.
2Shape
If the semiconductor chip is pressed from the upper side to suppress warpage, then the chip shape stability is improved, but the solder on the lower surface may be melted during heating
Solution Approach 1:
The pressing member is designed to apply pressure locally to specific regions of the semiconductor chip (such as the active area or regions away from solder pads) rather than uniformly across the entire chip surface. This localized pressing suppresses warpage while avoiding direct pressure on solder joints during heating, preventing solder melting and maintaining bonding reliability.
3Shape
If the chip thickness is reduced to suppress warpage, then the chip flexibility is improved, but the heat radiation efficiency may be compromised
Solution Approach 1:
The pressing member applies preliminary pressure to thin, flexible semiconductor chips during the soldering process to prevent convex warpage from developing. This ensures that even though the chips are thin and flexible, they maintain proper contact with the heat radiation material, preserving heat radiation efficiency while allowing the use of thinner chips for other performance benefits.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively suppresses convex warpage of the semiconductor chip and prevents voids in the solder, thereby improving heat radiation efficiency.
Implementation Method 1
a pressing member having a tip pressing the semiconductor chip from an upper side
Implementation Method 2
a semiconductor chip having flexibility and bonded to the heat radiation material with solder
Implementation Method 3
a lower surface of a semiconductor chip is connected to a cooling mechanism via solder, a heat radiation material, and an insulating material in order to efficiently dissipate heat generated by energization
Data Source
AI summary
A semiconductor chip (6) having flexibility is bonded to a heat radiation material (4) with solder. The semiconductor chip (6) is pressed by a tip of a pressing member (9,11) from an upper side. As a result, convex warpage of the semiconductor chip (6) can be suppressed. Furthermore, since voids can be prevented from remaining in the solder (7), the heat radiation of the semiconductor device can be enhanced.