Flexible Semiconductor Device With Dual-Modulus Dielectric Layers

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Solution Overview

Problem

Current flexible electronic devices often compromise on semiconductor device performance to achieve pliability, resulting in decreased characteristics.

Innovation Solution

A semiconductor device structure is designed with a substrate, multiple dielectric layers, and conductive layers, where the Young's modulus of a secondary dielectric layer is lower than the primary, allowing for enhanced flexibility while maintaining device characteristics by absorbing stress and reducing deformation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If a flexible semiconductor device structure is designed with multiple dielectric layers having different Young's moduli, then the flexibility and pliability of the device is improved, but the structural complexity and manufacturing difficulty increase

Engineering Contradiction:

ImproveflexibilityVSAvoidstructural complexity

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The dielectric layer is divided into a first dielectric layer and a second dielectric layer with different Young's moduli. The first dielectric layer (with higher Young's modulus) provides structural support, while the second dielectric layer (with lower Young's modulus) provides flexibility. This segmentation allows the device to achieve both structural integrity and pliability without excessive complexity.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different regions of the dielectric structure have different mechanical properties. The first dielectric layer has a higher Young's modulus for structural stability, while the second dielectric layer has a lower Young's modulus for flexibility. This local differentiation of material properties enables the device to simultaneously maintain shape and achieve bending capability.

Inventive Principle:

Principle #3Local quality

2Adaptability or versatility

If the Young's modulus of the second dielectric layer is made smaller than the first dielectric layer, then the pliability and flexibility are enhanced, but the manufacturing precision and control difficulty increase

Engineering Contradiction:

ImprovepliabilityVSAvoidmanufacturing precision

Core Design Contradiction:

Adaptability or versatilityVSManufacturing precision

Solution Approach 1:

The Young's modulus parameter is deliberately changed between the first and second dielectric layers. The first dielectric layer uses a material or structure with a higher Young's modulus, while the second dielectric layer uses a material or structure with a lower Young's modulus. This parameter differentiation is controlled during manufacturing to achieve the desired flexibility while maintaining manufacturability.

Inventive Principle:

Principle #35Parameter changes

3Ease of manufacture

If flexible electronic devices are designed with reduced performance characteristics, then the manufacturing cost and ease of manufacture are improved, but the device performance and reliability deteriorate

Engineering Contradiction:

Improvemanufacturing easeVSAvoiddevice performance

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The device structure is segmented into functional regions: the first dielectric layer provides structural support for reliability, while the second dielectric layer provides flexibility for manufacturability. This segmentation allows both high performance and ease of manufacture to be achieved simultaneously, rather than sacrificing performance for flexibility.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The dielectric structure uses a composite of two different dielectric layers with different mechanical properties. This composite structure combines the structural integrity needed for reliable device operation with the flexibility needed for easy manufacturing and processing, avoiding the need to reduce performance characteristics.

Inventive Principle:

Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The structure enhances the overall flexibility of semiconductor devices while preserving stable electrical characteristics, such as high pressure resistivity and low leakage current, enabling effective performance in flexible displays and circuits.

Implementation Method 1

The Young's modulus of the second dielectric layer is smaller than the Young's modulus of the first dielectric layer

Methodology Applied

Scientific EffectElasticity: Elasticity

Data Source

PatentUS9252165B2Semiconductor device structure, method for manufacturing the same and pixel structure using the same

Publication Date: 2016.02.02 HANNSTAR DISPLAY CORP

AI summary

A semiconductor device structure is provided. The semiconductor device structure may include a substrate, a semiconductor layer, a first conductive layer, a second conductive layer, a first dielectric layer and a second dielectric layer. The first dielectric layer is disposed on the substrate. The second dielectric layer is disposed on the first dielectric layer. The semiconductor layer is adjacent to the first dielectric layer or the second dielectric layer. The semiconductor layer is disposed on the first dielectric layer or the second dielectric layer. The first conductive layer is adjacent to the first dielectric layer or the second dielectric layer. The second conductive layer is disposed on the first dielectric layer or the second dielectric layer. The effective Young's modulus of the second dielectric layer may be smaller than the Young's modulus of the first dielectric layer.