Flexible Semiconductor Interconnection via Organic Insulating Layer
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Solution Overview
Problem
Semiconductor devices in wearable devices require flexibility and bending capabilities that existing technologies fail to adequately provide, as they are often rigid and lack effective interconnections for flexible integration.
Innovation Solution
A semiconductor device with a flexible structure is fabricated using a redistribution layer with an organic insulating layer that surrounds redistribution lines, allowing for free bending between semiconductor chips, enabling the device to be used in wearable devices and conformally disposed on non-flat surfaces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If semiconductor chips are physically bonded together using conventional interconnection methods, then electrical connectivity between chips is achieved, but the device loses flexibility and bending capability
Solution Approach 1:
The patent employs an organic insulating layer (flexible film) that surrounds the metal interconnection line, replacing rigid conventional packaging structures. This flexible insulating layer allows the interconnection to bend and deform without breaking, enabling the semiconductor device to maintain electrical connectivity while achieving flexibility and bending capability required for wearable applications
Solution Approach 2:
The patent creates a composite interconnection structure consisting of a metal line embedded within an organic insulating layer. This composite design combines the electrical conductivity of metal with the flexibility and mechanical protection of the organic material, resolving the contradiction between maintaining reliable electrical connectivity and achieving flexibility for wearable devices
2Reliability
If rigid interconnection structures are used to ensure stable electrical connectivity, then signal transmission reliability is improved, but the device cannot conform to non-flat surfaces or withstand repeated bending
Solution Approach 1:
The organic insulating layer acts as a flexible shell surrounding the metal interconnection, allowing the entire structure to conform to non-flat surfaces and withstand repeated bending cycles while maintaining stable signal transmission between semiconductor chips
3Ease of manufacture
If conventional rigid packaging is used for semiconductor chips, then manufacturing simplicity is maintained, but the device lacks the flexibility required for wearable applications
Solution Approach 1:
The patent replaces conventional rigid packaging materials with flexible organic insulating layers that can be deposited using standard semiconductor manufacturing processes, maintaining manufacturing simplicity while enabling wearable device compatibility through flexibility and bending capability
Data Source
AI summary
A semiconductor device includes a plurality of semiconductor chips spaced apart from each other. A space region is formed between adjacent semiconductor chips of the plurality of semiconductor chips. A redistribution layer is disposed on at least one of the semiconductor chips. The redistribution layer includes at least one redistribution line electrically connected to the at least one of the semiconductor chip. The redistribution layer includes an interconnection disposed in the space region. The interconnection includes an organic layer disposed on the at least one redistribution line. The organic layer is more flexible than the plurality of semiconductor chips.