Flexible Semiconductor Light Emitting Device with Segmented Chips
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Solution Overview
Problem
Existing semiconductor light emitting devices face challenges in efficiently illuminating wider areas as linear or surface light sources while maintaining mechanical strength and flexibility, particularly when mounted in a bent state on curved surfaces.
Innovation Solution
A semiconductor light emitting device with a multi-chip structure, featuring separated semiconductor layers, metal pillars, and a resin layer for reinforcement, which allows for flexible mounting on curved surfaces while maintaining high light output and mechanical strength through a specific interconnection and pillar design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If semiconductor light emitting devices are mounted in a bent state on curved surfaces to illuminate wider areas, then the adaptability and illumination coverage are improved, but the mechanical strength and structural integrity deteriorate
Solution Approach 1:
The device divides the semiconductor light emitting elements into multiple separate chips mounted on a flexible substrate, allowing the structure to bend without breaking while maintaining individual chip integrity. This segmentation enables mounting on curved surfaces without compromising mechanical strength.
Solution Approach 2:
The patent employs a flexible substrate as the base for mounting semiconductor chips, allowing the entire assembly to be bent and conform to curved surfaces. The flexible substrate acts as a thin film that maintains structural integrity while enabling adaptability to various shapes.
2Ease of operation
If multiple semiconductor layers are separated from one another to improve flexibility, then the ease of operation and adaptability are improved, but the mechanical strength and reliability worsen
Solution Approach 1:
The patent combines multiple separated semiconductor chips with a flexible substrate and reinforcement structures to create a unified assembly. This merging maintains the flexibility benefits of separated layers while restoring mechanical integrity through the integrated structure.
Solution Approach 2:
The device uses composite construction combining semiconductor chips, flexible substrate, and reinforcement elements to achieve both flexibility and mechanical strength. The composite structure allows separated semiconductor layers to maintain reliability while preserving ease of operation.
3Adaptability or versatility
If a multi-chip structure with separated semiconductor layers is used to achieve flexible mounting, then the adaptability is improved, but the device complexity increases
Solution Approach 1:
The multi-chip segmented structure enables flexible mounting on curved surfaces while the modular nature simplifies manufacturing and assembly processes. Each chip can be independently positioned and connected, reducing overall system complexity despite the multi-component design.
Data Source
AI summary
According to one embodiment, a semiconductor light emitting device includes a plurality of semiconductor layers, a first electrode, a second electrode, an insulating layer, a first interconnection layer, a second interconnection layer, a first metal pillar, a second metal pillar and a resin layer, and is mounted in a bent state on a curved surface. The plurality of semiconductor layers includes a first main surface, a second main surface opposite to the first main surface, and a light emitting layer, the plurality of semiconductor layers being separated from one another. A material is provided between the plurality of the semiconductor layers separated from one another. The member has a higher flexibility than the semiconductor layers being.